Inventor · disambiguated record

Yueh-Liang Liu

Also filed as: LIU YUEH-LIANG

2 granted patents·16 citations·filing 2000–2002

51Inventor score

Technology areasH10P

Files withWINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0163US6395646B1Machine for etching the edge of a wafer and method of etching the edge of a waferWINBOND ELECTRONICS CORP·Filed 2000·Granted May 28, 2002·16 cites·10 claims
0229US6780780B2Method for removing Si-needles of waferWINBOND ELECTRONICS CORP·Filed 2002·Granted Aug 24, 2004·0 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →