Inventor · disambiguated record
Yu-Ching Lo
Also filed as: LO YU-CHING
4 granted patents·1 pending application·0 citations·filing 2021–2025
58Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0184US2025364303A1Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0277US12441097B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0375US12391033B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0473US12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·14 claims
- 0567US11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →