Inventor · disambiguated record
Yuichi Matsuda
Also filed as: MATSUDA YUICHI
32 granted patents·12 pending applications·447 citations·filing 1994–2021
96Inventor score
Top patents by PatentIndex Score
44 records- 0198US6418615B1Method of making multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 16, 2002·164 cites·21 claims
- 0297US6441314B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 27, 2002·80 cites·13 claims
- 0391US8138609B2Semiconductor device and method of manufacturing semiconductor deviceHORIUCHI MICHIO·Filed 2010·Granted Mar 20, 2012·16 cites·10 claims
- 0491US6931724B2Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereonSHINKO ELECTRIC IND CO·Filed 2002·Granted Aug 23, 2005·35 cites·17 claims
- 0588US10858507B2Fiber-reinforced polypropylene-based resin composition and molded product thereofPRIME POLYMER CO LTD·Filed 2017·Granted Dec 8, 2020·2 cites·8 claims
- 0685US9460983B2Joining structure using thermal interface materialHORIUCHI MICHIO·Filed 2012·Granted Oct 4, 2016·8 cites·1 claims
- 0784US6828669B2Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2000·Granted Dec 7, 2004·33 cites·3 claims
- 0880US7847021B2Aliphatic polyester resin composition containing copolymerMITSUI CHEMICALS INC·Filed 2005·Granted Dec 7, 2010·11 cites·8 claims
- 0977US8324513B2Wiring substrate and semiconductor apparatus including the wiring substrateHORIUCHI MICHIO·Filed 2011·Granted Dec 4, 2012·5 cites·8 claims
- 1076US5510515AProcess for purifying polar vinyl compoundSHOWA DENKO KK·Filed 1994·Granted Apr 23, 1996·18 cites·12 claims
- 1173US7725548B2Computer-readable recording medium recording communication programs, communication method and communication apparatusFUJITSU LTD·Filed 2006·Granted May 25, 2010·6 cites·10 claims
- 1273US6756430B2Flame-retarding thermoplastic resin compositionMITSUI CHEMICALS INC·Filed 2001·Granted Jun 29, 2004·9 cites·33 claims
- 1372US5636206ASystem for achieving alarm masking processingFUJITSU LTD·Filed 1995·Granted Jun 3, 1997·39 cites·24 claims
- 1471US9535743B2Data processing control method, computer-readable recording medium, and data processing control device for performing a Mapreduce processFUJITSU LTD·Filed 2015·Granted Jan 3, 2017·2 cites·6 claims
- 1570US8242612B2Wiring board having piercing linear conductors and semiconductor device using the sameHORIUCHI MICHIO·Filed 2010·Granted Aug 14, 2012·3 cites·10 claims
- 1667US9006586B2Wiring substrate, its manufacturing method, and semiconductor deviceHORIUCHI MICHIO·Filed 2012·Granted Apr 14, 2015·2 cites·10 claims
- 1766US8664764B2Semiconductor device including a core substrate and a semiconductor elementHORIUCHI MICHIO·Filed 2012·Granted Mar 4, 2014·2 cites·17 claims
- 1863US8832496B2Information managing computer product, apparatus, and methodMATSUDA YUICHI·Filed 2011·Granted Sep 9, 2014·2 cites·9 claims
- 1962US7482063B2Molded object obtained by in-mold coating and process for producing the samePRIME POLYMER CO LTD·Filed 2003·Granted Jan 27, 2009·5 cites·9 claims
- 2060US7763809B2Multilayered substrate for semiconductor device and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 27, 2010·5 cites·12 claims
- 2154US2023002569A1Fiber-reinforced polypropylene-based resin composition and method for production thereofPRIME POLYMER CO LTD·Filed 2021·Application pending·0 cites
- 2247US9921874B2Storage medium, information processing device, and information processing methodFUJITSU LTD·Filed 2013·Granted Mar 20, 2018·0 cites·11 claims
- 2347US9459289B2Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 4, 2016·0 cites·10 claims
- 2447US2016376430A1Propylene resin compositionPRIME POLYMER CO LTD·Filed 2014·Application pending·0 cites
- 2546US9488677B2Probe card having a wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Nov 8, 2016·0 cites·6 claims
- 2646US9373587B2Stacked electronic deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 21, 2016·0 cites·7 claims
- 2746US2013048350A1Base memberHORIUCHI MICHIO·Filed 2012·Application pending·0 cites
- 2845US9476913B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 25, 2016·0 cites·6 claims
- 2945US9470718B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 18, 2016·0 cites·5 claims
- 3045US9204544B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 1, 2015·0 cites·4 claims
- 3144US9344347B2Delay time measuring apparatus, computer readable record medium on which delay time measuring program is recorded, and delay time measuring methodMATSUDA YUICHI·Filed 2009·Granted May 17, 2016·0 cites·7 claims
- 3244US8638542B2Capacitor containing a large number of filamentous conductors and method of manufacturing the sameHORIUCHI MICHIO·Filed 2010·Granted Jan 28, 2014·0 cites·9 claims
- 3343US8362369B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2010·Granted Jan 29, 2013·0 cites·6 claims
- 3443US2007174282A1Access control method, access control apparatus, and computer productFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3543US2014372611A1Assigning method, apparatus, and systemFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3639US2019286468A1Efficient control of containers in a parallel distributed systemFUJITSU LTD·Filed 2019·Application pending·0 cites
- 3738US9698037B2Substrate processing apparatusNAKASHIMA SEIYO·Filed 2011·Granted Jul 4, 2017·0 cites·17 claims
- 3838US2011095433A1Conductive film, method of manufacturing the same, semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 3938US2011095419A1Conductive film, method of manufacturing the same, semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 4037US9202781B2Wiring substrate, method for manufacturing wiring substrate, and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 1, 2015·0 cites·11 claims
- 4137US2012159519A1Event dependency management apparatus and event dependency management methodMATSUDA YUICHI·Filed 2011·Application pending·0 cites
- 4236US2015365474A1Computer-readable recording medium, task assignment method, and task assignment apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 4335US2015128150A1Data processing method and information processing apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 4433US2015254102A1Computer-readable recording medium, task assignment device, task execution device, and task assignment methodFUJITSU LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuichi Matsuda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →