Inventor · disambiguated record
Yuya Matsuda
Also filed as: MATSUDA YUYA
13 granted patents·4 pending applications·27 citations·filing 2007–2022
85Inventor score
Files withTOSHIBA KK5TOSHIBA MEMORY CORP4KOBELCO CONSTR MACH CO LTD2DEVINE DANIEL J1FUKUI PREFECTURAL GOVERNMENT1
Top patents by PatentIndex Score
17 records- 0189US9343405B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Granted May 17, 2016·8 cites·11 claims
- 0286US9184072B2Advanced multi-workpiece processing chamberDEVINE DANIEL J·Filed 2007·Granted Nov 10, 2015·16 cites·45 claims
- 0371US10269608B2Semiconductor manufacturing apparatus and method of operating the sameTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 23, 2019·1 cites·8 claims
- 0465US10546867B2Method for manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Jan 28, 2020·1 cites·13 claims
- 0558US10079184B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Sep 18, 2018·1 cites·8 claims
- 0654US2024052594A1Work assistance system and work assistance composite systemKOBELCO CONSTR MACH CO LTD·Filed 2021·Application pending·0 cites
- 0749US12125729B2Substrate storage apparatus and substrate processing systemKIOXIA CORP·Filed 2022·Granted Oct 22, 2024·0 cites·12 claims
- 0849US9799546B2Semiconductor manufacturing apparatus and method of operating the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 24, 2017·0 cites·16 claims
- 0949US9087884B1Manufacturing method of semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2015·Granted Jul 21, 2015·0 cites·13 claims
- 1048US10307964B2Three-dimensional molding methodFUKUI PREFECTURAL GOVERNMENT·Filed 2018·Granted Jun 4, 2019·0 cites·11 claims
- 1147US12163312B2Work support system and work support composite systemKOBELCO CONSTR MACH CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·4 claims
- 1245US11616297B2Active phased array antenna device and power supply control methodMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 28, 2023·0 cites·13 claims
- 1344US8993430B2Manufacturing method of semiconductor device and semiconductor deviceMATSUDA YUYA·Filed 2012·Granted Mar 31, 2015·0 cites·7 claims
- 1443US2015214103A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1539US2014319594A1Nonvolatile semiconductor storage device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1638US10190966B2Metal-pipe use support systemNIPPON STEEL & SUMITOMO METAL CORP·Filed 2015·Granted Jan 29, 2019·0 cites·13 claims
- 1734US2017243880A1Semiconductor manufacturing device and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →