Inventor · disambiguated record
Yuichi Minoura
Also filed as: MINOURA YUICHI
22 granted patents·6 pending applications·81 citations·filing 2010–2022
93Inventor score
Top patents by PatentIndex Score
28 records- 0196US9685338B2Compound semiconductor device and method of manufacturing the sameTRANSPHORM JAPAN INC·Filed 2016·Granted Jun 20, 2017·18 cites·8 claims
- 0294US9425268B2Compound semiconductor device and method of manufacturing the sameTRANSPHORM JAPAN INC·Filed 2013·Granted Aug 23, 2016·17 cites·10 claims
- 0391US9312350B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2014·Granted Apr 12, 2016·9 cites·6 claims
- 0487US8969921B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2013·Granted Mar 3, 2015·7 cites·15 claims
- 0586US9553152B2Semiconductor deviceFUJITSU LTD·Filed 2014·Granted Jan 24, 2017·8 cites·10 claims
- 0685US9947781B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2017·Granted Apr 17, 2018·3 cites·5 claims
- 0779US9728618B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2016·Granted Aug 8, 2017·2 cites·4 claims
- 0879US9035353B2Compound semiconductor device comprising electrode above compound semiconductor layer and method of manufacturing the sameOHKI TOSHIHIRO·Filed 2012·Granted May 19, 2015·5 cites·17 claims
- 0974US9496380B2Compound semiconductor device comprising compound semiconductor layered structure having buffer layer and method of manufacturing the sameMINOURA YUICHI·Filed 2011·Granted Nov 15, 2016·3 cites·15 claims
- 1070US8586433B2Compound semiconductor device and manufacturing method thereofMINOURA YUICHI·Filed 2012·Granted Nov 19, 2013·3 cites·16 claims
- 1168US9035414B2Compound semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2013·Granted May 19, 2015·2 cites·20 claims
- 1264US8461041B2Semiconductor device and method of manufacturing semiconductor deviceOZAKI SHIROU·Filed 2010·Granted Jun 11, 2013·1 cites·12 claims
- 1362US8791465B2Compound semiconductor device and manufacturing thereforOKAMOTO NAOYA·Filed 2012·Granted Jul 29, 2014·1 cites·8 claims
- 1462US8709886B2Compound semiconductor device and manufacturing method thereforMAKIYAMA KOZO·Filed 2012·Granted Apr 29, 2014·1 cites·6 claims
- 1560US8937337B2Compound semiconductor device, method of manufacturing the same, power supply device and high-frequency amplifierMINOURA YUICHI·Filed 2011·Granted Jan 20, 2015·1 cites·7 claims
- 1655US9306031B2Compound semiconductor device, method of manufacturing the same, power supply device and high-frequency amplifierFUJITSU LTD·Filed 2014·Granted Apr 5, 2016·0 cites·9 claims
- 1754US9209042B2Compound semiconductor device and manufacturing method thereforOKAMOTO NAOYA·Filed 2014·Granted Dec 8, 2015·0 cites·5 claims
- 1853US9035357B2Compound semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2014·Granted May 19, 2015·0 cites·7 claims
- 1951US10804358B2Compound semiconductor device and method with high concentration dopant layer in regrown compound semiconductorFUJITSU LTD·Filed 2018·Granted Oct 13, 2020·0 cites·18 claims
- 2051US2023231045A1Semiconductor device, method for manufacturing semiconductor device, and electronic deviceFUJITSU LTD·Filed 2022·Application pending·0 cites
- 2150US10483185B2Semiconductor device and method for manufacturing sameFUJITSU LTD·Filed 2018·Granted Nov 19, 2019·0 cites·13 claims
- 2248US10964805B2Compound semiconductor deviceFUJITSU LTD·Filed 2019·Granted Mar 30, 2021·0 cites·11 claims
- 2341US2019326404A1Semiconductor device and method for manufacturing the sameFUJITSU LTD·Filed 2019·Application pending·0 cites
- 2439US2011223766A1Method and apparatus for manufacturing semiconductor deviceFUJITSU LTD·Filed 2011·Application pending·0 cites
- 2539US2013075750A1Semiconductor deviceMINOURA YUICHI·Filed 2012·Application pending·0 cites
- 2638US9034722B2Method of removing a compound semiconductor layer from a compound semiconductor deviceMINOURA YUICHI·Filed 2010·Granted May 19, 2015·0 cites·13 claims
- 2738US2013083569A1Manufacturing method of compound semiconductor deviceMINOURA YUICHI·Filed 2012·Application pending·0 cites
- 2837US2017125570A1Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →