Inventor · disambiguated record
Yuji Miyazaki
Also filed as: MIYAZAKI YUJI
26 granted patents·8 pending applications·177 citations·filing 1985–2023
95Inventor score
Files withMITSUBISHI ELECTRIC CORP9ODAWARA ENGINEERING CO LTD7SUMCO CORP7CITIZEN WATCH CO LTD3JST MFG CO LTD3
Top patents by PatentIndex Score
34 records- 0189US11349378B2Coil segment cutting method and coil segment cutting apparatusODAWARA ENGINEERING CO LTD·Filed 2020·Granted May 31, 2022·2 cites·9 claims
- 0288US10971979B2Coil segment forming apparatus, coil segment forming method and manufacturing apparatus of electrical rotating machineODAWARA ENGINEERING CO LTD·Filed 2018·Granted Apr 6, 2021·4 cites·5 claims
- 0388US8040162B2Switch matrix drive circuit for a power elementMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Oct 18, 2011·18 cites·16 claims
- 0483US10944311B2Nozzle turning apparatus and winding machineODAWARA ENGINEERING CO LTD·Filed 2019·Granted Mar 9, 2021·2 cites·11 claims
- 0581US11621618B2Coil segment processing method, coil segment processing apparatus and connection structure of coil segmentsODAWARA ENGINEERING CO LTD·Filed 2020·Granted Apr 4, 2023·1 cites·17 claims
- 0681US11018563B2Manufacturing apparatus and manufacturing method of electrical rotating machineODAWARA ENGINEERING CO LTD·Filed 2019·Granted May 25, 2021·3 cites·12 claims
- 0777US7794288B2ConnectorJST MFG CO LTD·Filed 2007·Granted Sep 14, 2010·17 cites·7 claims
- 0874US11251687B2Coil segment forming apparatus and manufacturing apparatus of electrical rotating machineODAWARA ENGINEERING CO LTD·Filed 2018·Granted Feb 15, 2022·1 cites·10 claims
- 0974US4664900AElectrically conductive compositionsDENKI KAGAKU KOGYO KK·Filed 1985·Granted May 12, 1987·33 cites·14 claims
- 1073US6401781B1Pneumatic radial tire with under-belt pad and specified intermediate rubber layer rubber compoundTOYO TIRE & RUBBER CO·Filed 2000·Granted Jun 11, 2002·9 cites·4 claims
- 1172US6138731APneumatic radial tire with specified under-belt pad rubber compoundTOYO TIRE & RUBBER CO·Filed 1998·Granted Oct 31, 2000·30 cites·5 claims
- 1270US11648640B2Method of double-side polishing waferSUMCO CORP·Filed 2018·Granted May 16, 2023·1 cites·3 claims
- 1370US10601307B1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 24, 2020·1 cites·10 claims
- 1469US2025289090A1Apparatus for measuring thickness of workpiece, method for measuring thickness of workpiece, and system for polishing workpieceSUMCO CORP·Filed 2023·Application pending·0 cites
- 1566US8455997B2High power semiconductor deviceNAKANISHI HIDETOSHI·Filed 2011·Granted Jun 4, 2013·2 cites·3 claims
- 1666US8029310B2ConnectorJST MFG CO LTD·Filed 2007·Granted Oct 4, 2011·10 cites·5 claims
- 1763US2025353141A1Method for dressing polishing pad, method for polishing silicon wafer, method for producing silicon wafer, and device for polishing silicon waferSUMCO CORP·Filed 2023·Application pending·0 cites
- 1862US6742422B1Numerically controlled lathe and method of cutting workpiece on the numerically controlled latheCITIZEN WATCH CO LTD·Filed 2000·Granted Jun 1, 2004·11 cites·7 claims
- 1961US6971294B1Numerically controlled lathe and method of machining work using this numerically controlled latheCITIZEN WATCH CO LTD·Filed 2000·Granted Dec 6, 2005·9 cites·10 claims
- 2059US9979314B2Power semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 22, 2018·1 cites·20 claims
- 2157US9094012B2Driving circuit and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 28, 2015·1 cites·14 claims
- 2256US2025353133A1Management device, management method, and wafer manufacturing systemSUMCO CORP·Filed 2023·Application pending·0 cites
- 2354US6269857B1Run-flat tire with side-reinforcing rubber pad and fibrous layerTOYO TIRE & RUBBER CO·Filed 1999·Granted Aug 7, 2001·21 cites·15 claims
- 2452US2024261929A1Double-side polishing apparatus and double-side polishing method for workpiecesSUMCO CORP·Filed 2022·Application pending·0 cites
- 2551US2024123566A1Processing condition setting apparatus, processing condition setting method, and wafer production systemSUMCO CORP·Filed 2022·Application pending·0 cites
- 2650US10483965B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 19, 2019·0 cites·16 claims
- 2749US12107466B2Twisting method of coil segments, twisting jig and twisting apparatusODAWARA ENGINEERING CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·10 claims
- 2849US9685879B2Power semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 20, 2017·0 cites·20 claims
- 2948US2021366886A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3047US2010149774A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2009·Application pending·0 cites
- 3145US2022184772A1Method and apparatus for double-side polishing workSUMCO CORP·Filed 2019·Application pending·0 cites
- 3243US11888259B2ConnectorJST MFG CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·8 claims
- 3337US11355477B2Power semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 7, 2022·0 cites·14 claims
- 3431US7055416B2Tool holder and method of machining work using this tool holderCITIZEN WATCH CO LTD·Filed 2000·Granted Jun 6, 2006·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →