Inventor · disambiguated record
Yutaka Nabeshima
Also filed as: NABESHIMA YUTAKA
13 granted patents·5 pending applications·225 citations·filing 1990–2022
91Inventor score
Files withPANASONIC CORP5MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4KYOCERA CORP3UNITIKA LTD3FUKAMIZU SHINGO2
Top patents by PatentIndex Score
18 records- 0190US5164337AMethod of fabricating a semiconductor device having a capacitor in a stacked memory cellMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Nov 17, 1992·123 cites·8 claims
- 0288US7515394B2Placement configuration of MIM type capacitance elementPANASONIC CORP·Filed 2006·Granted Apr 7, 2009·15 cites·24 claims
- 0374US7978043B2Semiconductor devicePANASONIC CORP·Filed 2010·Granted Jul 12, 2011·4 cites·18 claims
- 0473US7687900B2Semiconductor integrated circuit device and fabrication method for the samePANASONIC CORP·Filed 2008·Granted Mar 30, 2010·6 cites·16 claims
- 0566US7667316B2Semiconductor integrated circuit and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Feb 23, 2010·5 cites·21 claims
- 0665US7977767B2Spiral planar inductor and manufacturing method thereofPANASONIC CORP·Filed 2008·Granted Jul 12, 2011·4 cites·8 claims
- 0765US5296095AMethod of dry etchingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Mar 22, 1994·36 cites·4 claims
- 0864US11254814B2Resin composition and molded product obtained therefromUNITIKA LTD·Filed 2020·Granted Feb 22, 2022·0 cites·17 claims
- 0964US10673409B2SAW device and method for manufacturing SAW deviceKYOCERA CORP·Filed 2015·Granted Jun 2, 2020·1 cites·13 claims
- 1058US2024026151A1Resin composition and molded productUNITIKA LTD·Filed 2020·Application pending·0 cites
- 1156US7321158B2Method of manufacturing variable capacitance diode and variable capacitance diodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jan 22, 2008·5 cites·6 claims
- 1256US5384276AMethod of fabricating a memory device with a multilayer insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Jan 24, 1995·23 cites·4 claims
- 1355US8138615B2Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereofFUKAMIZU SHINGO·Filed 2007·Granted Mar 20, 2012·2 cites·11 claims
- 1452US8179659B2Placement configuration of MIM type capacitance elementNABESHIMA YUTAKA·Filed 2008·Granted May 15, 2012·1 cites·19 claims
- 1551US2024230240A9Thermal deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1644US2020317911A1Resin composition and molded articleUNITIKA LTD·Filed 2017·Application pending·0 cites
- 1740US2015076685A1Flow path member, and heat exchanger and semiconductor device using the sameKYOCERA CORP·Filed 2013·Application pending·0 cites
- 1838US2008128826A1Semiconductor integrated circuit and fabrication method for the sameFUKAMIZU SHINGO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →