Inventor · disambiguated record
Yuhei Nishida
Also filed as: NISHIDA YUHEI
8 granted patents·2 pending applications·11 citations·filing 2014–2024
75Inventor score
Files withFUJI ELECTRIC CO LTD10
Top patents by PatentIndex Score
10 records- 0186US9711430B2Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Jul 18, 2017·9 cites·20 claims
- 0273US10937727B2Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·20 claims
- 0359US2025157897A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0458US11552021B2Semiconductor device, semiconductor manufacturing apparatus and method of manufacturing semiconductor device having printed circuit board and insulating board with complementary warpsFUJI ELECTRIC CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·9 claims
- 0557US11996347B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted May 28, 2024·0 cites·18 claims
- 0648US2024088796A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0742US11037848B2Semiconductor module and semiconductor module manufacturing methodFUJI ELECTRIC CO LTD·Filed 2018·Granted Jun 15, 2021·0 cites·20 claims
- 0840US9299642B2Semiconductor device and method for producing sameFUJI ELECTRIC CO LTD·Filed 2015·Granted Mar 29, 2016·0 cites·19 claims
- 0935US11749581B2Semiconductor module and method for manufacturing sameFUJI ELECTRIC CO LTD·Filed 2019·Granted Sep 5, 2023·0 cites·13 claims
- 1035US9824950B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Nov 21, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →