Inventor · disambiguated record
Yutaka Odaka
Also filed as: ODAKA YUTAKA
0 granted patents·4 pending applications·0 citations·filing 2005–2009
Technology areasH10P
Files withSHINKAWA KK4
Top patents by PatentIndex Score
4 records- 0156US2010077590A1Die pickup methodSHINKAWA KK·Filed 2009·Application pending·0 cites
- 0247US2010078125A1Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonderSHINKAWA KK·Filed 2008·Application pending·0 cites
- 0347US2006137828A1Die pickup apparatusSHINKAWA KK·Filed 2005·Application pending·0 cites
- 0444US2007082529A1Die pickup apparatus, method for using the same and die pickup methodSHINKAWA KK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →