Inventor · disambiguated record
Yun-Jin Oh
Also filed as: OH YUN JIN
3 granted patents·54 citations·filing 2007–2012
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0193US8664780B2Semiconductor package having plural semiconductor chips and method of forming the sameHAN CHANG-HOON·Filed 2012·Granted Mar 4, 2014·50 cites·19 claims
- 0256US7868460B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 11, 2011·2 cites·9 claims
- 0352US8063313B2Printed circuit board and semiconductor package including the sameOH YUN-JIN·Filed 2008·Granted Nov 22, 2011·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →