Inventor · disambiguated record
Yu Hong Oh
Also filed as: OH YU HONG
11 granted patents·2 pending applications·1 citations·filing 2016–2024
79Inventor score
Files withSAMSUNG ELECTRO MECH13
Top patents by PatentIndex Score
13 records- 0185US11715595B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 1, 2023·1 cites·19 claims
- 0279US12230443B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 18, 2025·0 cites·6 claims
- 0378US12148570B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 19, 2024·0 cites·16 claims
- 0477US12488944B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Dec 2, 2025·0 cites·24 claims
- 0573US2024222019A1Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0670US11967462B2Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 23, 2024·0 cites·32 claims
- 0770US11664162B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 30, 2023·0 cites·14 claims
- 0869US12062492B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 13, 2024·0 cites·21 claims
- 0965US12057271B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 6, 2024·0 cites·22 claims
- 1063US11791095B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 1156US11715602B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 1, 2023·0 cites·23 claims
- 1254US11476047B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 18, 2022·0 cites·25 claims
- 1335US2017094786A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →