Inventor · disambiguated record
Yuichiro Okuyama
Also filed as: OKUYAMA YUICHIRO
13 granted patents·59 citations·filing 2005–2021
87Inventor score
Files withTDK CORP13
Top patents by PatentIndex Score
13 records- 0191US7471930B2High frequency moduleTDK CORP·Filed 2005·Granted Dec 30, 2008·26 cites·9 claims
- 0286US7565116B2High frequency moduleTDK CORP·Filed 2005·Granted Jul 21, 2009·15 cites·10 claims
- 0381US7412210B2High frequency moduleTDK CORP·Filed 2006·Granted Aug 12, 2008·10 cites·10 claims
- 0464US7388453B2High frequency moduleTDK CORP·Filed 2005·Granted Jun 17, 2008·3 cites·15 claims
- 0563US7463115B2High frequency electronic componentTDK CORP·Filed 2006·Granted Dec 9, 2008·3 cites·8 claims
- 0662US7650120B2High frequency moduleTDK CORP·Filed 2008·Granted Jan 19, 2010·2 cites·7 claims
- 0760US11545303B2Electronic component and its manufacturing methodTDK CORP·Filed 2021·Granted Jan 3, 2023·0 cites·9 claims
- 0859US11452209B2Electronic component and its manufacturing methodTDK CORP·Filed 2020·Granted Sep 20, 2022·0 cites·16 claims
- 0957US11328872B2LC composite componentTDK CORP·Filed 2019·Granted May 10, 2022·0 cites·6 claims
- 1055US11967469B2Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the sameTDK CORP·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 1152US11776947B2Electronic component and manufacturing method thereforTDK CORP·Filed 2021·Granted Oct 3, 2023·0 cites·3 claims
- 1245US11515854B2LC composite componentTDK CORP·Filed 2019·Granted Nov 29, 2022·0 cites·6 claims
- 1345US10426032B1Multilayer wiring structure and its manufacturing methodTDK CORP·Filed 2019·Granted Sep 24, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →