Inventor · disambiguated record
Yutaka Ooka
Also filed as: OOKA YUTAKA
34 granted patents·10 pending applications·99 citations·filing 2005–2024
97Inventor score
Top patents by PatentIndex Score
44 records- 0197US11804502B2Solid-state imaging element and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Oct 31, 2023·3 cites·7 claims
- 0297US11594563B2Image sensor having improved dicing propertiesSONY CORP·Filed 2021·Granted Feb 28, 2023·3 cites·16 claims
- 0394US10756130B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2018·Granted Aug 25, 2020·3 cites·20 claims
- 0494US9064763B2Solid-state imaging element, solid-state imaging device, imaging apparatus, and method of manufacturing polarizing elementOZAWA KEN·Filed 2011·Granted Jun 23, 2015·16 cites·19 claims
- 0593US9991301B2Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the sameSONY CORP·Filed 2015·Granted Jun 5, 2018·8 cites·20 claims
- 0692US10038021B2Packaged image sensor having improved dicing propertiesSONY CORP·Filed 2017·Granted Jul 31, 2018·6 cites·14 claims
- 0792US9941318B2Semiconductor device and electronic apparatus including an organic material layer between a dummy lens and a transparent substrateSONY CORP·Filed 2017·Granted Apr 10, 2018·5 cites·28 claims
- 0892US9105774B2Manufacturing method of solid-state imaging device and solid-state imaging deviceSONY CORP·Filed 2013·Granted Aug 11, 2015·7 cites·17 claims
- 0991US10236315B2Solid-state image pickup element, image pickup apparatus, electronic apparatus, and production methodSONY CORP·Filed 2014·Granted Mar 19, 2019·8 cites·15 claims
- 1090US10608028B2Image sensor having improved dicing propertiesSONY CORP·Filed 2018·Granted Mar 31, 2020·4 cites·15 claims
- 1190US10332924B2Package and electronic apparatus including a package having a microlens layer and color filter layerSONY CORP·Filed 2018·Granted Jun 25, 2019·4 cites·20 claims
- 1290US2024371896A1Solid-state image sensor and electronic deviceSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 1389US11024658B2Image sensor including groovesSONY CORP·Filed 2020·Granted Jun 1, 2021·2 cites·20 claims
- 1488US11619772B2Semiconductor chip and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Apr 4, 2023·1 cites·13 claims
- 1587US10032816B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2016·Granted Jul 24, 2018·3 cites·16 claims
- 1687US9257474B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2013·Granted Feb 9, 2016·2 cites·19 claims
- 1786US11031422B2Solid-state imaging element and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jun 8, 2021·2 cites·8 claims
- 1885US12068346B2Solid-state image sensor and electronic deviceSONY GROUP CORP·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1985US11037975B2Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrateSONY CORP·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 2085US9929197B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2017·Granted Mar 27, 2018·2 cites·30 claims
- 2184US9812479B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2017·Granted Nov 7, 2017·2 cites·30 claims
- 2284US9728568B2Semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 8, 2017·3 cites·16 claims
- 2381US7718524B2Method of manufacturing semiconductor deviceSONY CORP·Filed 2006·Granted May 18, 2010·10 cites·1 claims
- 2480US12009377B2Solid-state imaging device and electronic apparatus for curbing deterioration of picture qualitySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Jun 11, 2024·1 cites·19 claims
- 2576US11600648B2Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrateSONY GROUP CORP·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2675US11581346B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2020·Granted Feb 14, 2023·0 cites·19 claims
- 2775US11557573B2Semiconductor device, manufacturing method for semiconductor device, and electronic deviceSONY GROUP CORP·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 2875US2024055451A1Solid-state imaging element and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 2975US2023178575A1Semiconductor device and electronic apparatusSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 3074US9922961B2Semiconductor device, manufacturing method for semiconductor device, and electronic deviceSONY CORP·Filed 2016·Granted Mar 20, 2018·1 cites·20 claims
- 3174US2024304641A1Solid-state imaging device and electronic apparatus to curb deterioriation of picture qualitySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 3272US8441088B2Manufacturing method of solid-state imaging device and solid-state imaging deviceOOKA YUTAKA·Filed 2011·Granted May 14, 2013·1 cites·8 claims
- 3370US11616090B2Solid-state imaging element and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Mar 28, 2023·0 cites·7 claims
- 3468US2022157873A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3565US11063020B2Semiconductor device, manufacturing method for semiconductor device, and electronic deviceSONY CORP·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3661US10373934B2Semiconductor device, manufacturing method for semiconductor device, and electronic deviceSONY CORP·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 3758US9524925B2Method of manufacturing a semiconductor deviceSONY CORP·Filed 2016·Granted Dec 20, 2016·0 cites·7 claims
- 3858US9343392B2Semiconductor device, manufacturing method for semiconductor device, and electronic deviceSONY CORP·Filed 2013·Granted May 17, 2016·0 cites·12 claims
- 3955US2016284753A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2014·Application pending·0 cites
- 4054US11048028B2Semiconductor chip and electronic apparatus for suppressing degradation of semiconductor chipSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jun 29, 2021·0 cites·13 claims
- 4151US2024186352A1Imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4251US2017263665A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2017·Application pending·0 cites
- 4341US2006163739A1Semiconductor device and method for production thereofKOMAI NAOKI·Filed 2005·Application pending·0 cites
- 4439US2021272995A1Imaging element and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →