Inventor · disambiguated record
Yuki Ori
Also filed as: ORI YUKI
3 granted patents·2 pending applications·3 citations·filing 2017–2023
52Inventor score
Top patents by PatentIndex Score
5 records- 0190US10925171B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·3 cites·22 claims
- 0256US2025185225A1Electromagnetic Wave Shielding Material, Covering Material or Exterior Material, and Electric/Electronic ApparatusJX ADVANCED METALS CORP·Filed 2022·Application pending·0 cites
- 0354US2025261354A1Electromagnetic Wave Shielding Material, Covering Material or Exterior Material, and Electric/Electronic ApparatusJX ADVANCED METALS CORP·Filed 2023·Application pending·0 cites
- 0453US10925170B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·25 claims
- 0551US10791631B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 29, 2020·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →