Inventor · disambiguated record
Yu-Cheng Pai
Also filed as: PAI YU-CHENG
22 granted patents·23 pending applications·9 citations·filing 2011–2024
90Inventor score
Top patents by PatentIndex Score
45 records- 0169US10141266B2Method of fabricating semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 0268US9490225B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·2 cites·20 claims
- 0364US9607860B2Electronic package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·1 cites·17 claims
- 0463US9716060B2Package structure with an embedded electronic component and method of fabricating the package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 25, 2017·1 cites·12 claims
- 0560US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 0660US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 0759US11205644B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·12 claims
- 0859US8471383B2Semiconductor package and fabrication method thereofHUNG LIANG-YI·Filed 2011·Granted Jun 25, 2013·2 cites·16 claims
- 0957US9510463B2Coreless packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·9 claims
- 1056US2025385145A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1153US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 1253US2017171981A1Method of fabricating substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 1353US2025336794A1Package substrate and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1452US10629572B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·12 claims
- 1552US10068842B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·13 claims
- 1652US10002825B2Method of fabricating package structure with an embedded electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·23 claims
- 1752US2025379130A1Package substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1852US2016013123A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1951US10147615B2Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 4, 2018·0 cites·8 claims
- 2051US9899249B2Fabrication method of coreless packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 2150US9735080B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·8 claims
- 2250US2025132236A1Package substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2349US12469774B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·9 claims
- 2449US10043757B2Semiconductor package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·10 claims
- 2549US9905438B2Method of manufacturing package substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·13 claims
- 2649US9640503B2Package substrate, semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 2, 2017·0 cites·17 claims
- 2749US2016081186A1Substrate structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2849US2018247891A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2948US2017301658A1Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 3048US2014057410A1Method of fabricating a packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 3146US10096491B2Method of fabricating a packaging substrate including a carrier having two carrying portionsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·5 claims
- 3246US2023027120A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Application pending·0 cites
- 3346US2024282689A1Electronic package, packaging substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 3445US11239125B2Carrier structure and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 1, 2022·0 cites·14 claims
- 3545US2016118323A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3644US2015325516A1Coreless packaging substrate, pop structure, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 3744US2015333029A1Package substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 3843US2016071780A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3942US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4041US2015028485A1Substrate structure and semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4139US2013026657A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 4238US2020328142A1Package stack structure, method for fabricating the same, and carrier componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
- 4334US2013228921A1Substrate structure and fabrication method thereofHUNG LIANG-YI·Filed 2012·Application pending·0 cites
- 4433US2016086879A1Package substrate and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 4531US2016093546A1Package stucture and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yu-Cheng Pai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →