Inventor · disambiguated record
Yukyung Park
Also filed as: PARK YUKYUNG
10 granted patents·3 pending applications·12 citations·filing 2020–2025
82Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0195US11587859B2Wiring protection layer on an interposer with a through electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·5 cites·20 claims
- 0295US11195785B2Interposer with through electrode having a wiring protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·5 cites·20 claims
- 0383US11984415B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·1 cites·20 claims
- 0481US11784131B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·1 cites·11 claims
- 0578US2025132238A1Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0675US12272630B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 0774US12417988B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·13 claims
- 0873US12142573B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0972US12218043B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1072US2025192015A1Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1167US11482483B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1266US11728255B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·11 claims
- 1350US2023066895A1Inductor and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →