Inventor · disambiguated record
Yu-Yun Peng
Also filed as: PENG YU · PENG YU-YUN
66 granted patents·33 pending applications·586 citations·filing 2006–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD91TAIWAN SEMICONDUCTOR MFG2LIOU JOUNG-WEI1PENG YU-YUN1SHIH PO-CHENG1
Top patents by PatentIndex Score
99 records- 0198US9754818B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·472 cites·20 claims
- 0297US10950731B1Inner spacers for gate-all-around semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·25 cites·20 claims
- 0397US9659811B1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·19 cites·20 claims
- 0496US9412648B1Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 9, 2016·13 cites·20 claims
- 0593US11158539B2Method and structure for barrier-less plugTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·6 cites·19 claims
- 0692US11393677B2Semiconductor device structure with gate spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0790US11942358B2Low thermal budget dielectric for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·2 cites·20 claims
- 0889US11227794B2Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·3 cites·20 claims
- 0989US10535512B2Formation method of semiconductor device with gate spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·4 cites·20 claims
- 1088US10867785B2Structure and formation method of semiconductor device with gate spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·2 cites·20 claims
- 1187US12341013B2Method and structure for barrier-less plugTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 1287US11855214B2Inner spacers for gate-all-around semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 1387US10991636B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·3 cites·20 claims
- 1487US10971391B2Dielectric gap fillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 6, 2021·3 cites·20 claims
- 1586US11817343B2Dielectric gap fillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·1 cites·20 claims
- 1686US10510895B2Device and method of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·2 cites·20 claims
- 1786US10340178B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 1886US2025301691A1Inner spacers for gate-all-around semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1986US2025308901A1Method and structure for barrier-less plugTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2086US2024332419A1Device of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2185US12336214B2Inner spacers for gate-all-around semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2285US12255249B2Inner spacer structures for gate-all-around field effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2385US10879111B1Dielectric plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 2483US9054110B2Low-K dielectric layer and porogenLIOU JOUNG-WEI·Filed 2011·Granted Jun 9, 2015·5 cites·21 claims
- 2581US11373866B2Dielectric material and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 28, 2022·2 cites·20 claims
- 2681US10957585B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 23, 2021·5 cites·20 claims
- 2781US2024387358A1Methods for manufacturing an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2880US12315837B2Storage layers for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2980US11804539B2Transistor isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 3080US2025203992A1Inner spacer structures for gate-all-around field effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3179US12308312B2Interconnect structure and method for manufacturing the interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 3279US10669625B2Pumping liner for chemical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 2, 2020·2 cites·20 claims
- 3379US10510584B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·1 cites·20 claims
- 3478US11854796B2Semiconductor device structure with gate spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3578US10141220B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 3678US2025253282A1Storage layers for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3778US2024243009A1Self-aligned barrier for metal viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3878US2025366044A1Seam-top seal for dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3978US2024249947A1Device of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4078US2025366140A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4177US12034075B2Device of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 4277US2025329574A1Isolation structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4377US2025351475A1Metal-Comprising Bottom Isolation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4476US12051592B2Method and structure for barrier-less plugTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 4576US8889567B2Apparatus and methods for low K dielectric layersPENG YU-YUN·Filed 2011·Granted Nov 18, 2014·4 cites·20 claims
- 4675US11972974B2Self-aligned barrier for metal viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·20 claims
- 4775US11637062B2Interconnect structure and method for manufacturing the interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 25, 2023·0 cites·20 claims
- 4875US9177918B2Apparatus and methods for low k dielectric layersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 3, 2015·2 cites·20 claims
- 4975US2024387653A1Liner layer for backside contacts of seimiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5075US2023377944A1Dielectric Gap FillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →