Inventor · disambiguated record
Yu-Tzu Peng
Also filed as: PENG YU-TZU
4 granted patents·16 citations·filing 2017–2018
71Inventor score
Files withADVANCED SEMICONDUCTOR ENG4
Top patents by PatentIndex Score
4 records- 0189US10446411B2Semiconductor device package with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 15, 2019·5 cites·18 claims
- 0286US10049893B2Semiconductor device with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 14, 2018·4 cites·23 claims
- 0385US10134683B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·6 cites·21 claims
- 0460US10453764B2Molding for large panel fan-out packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 22, 2019·1 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Yu-Tzu Peng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →