Inventor · disambiguated record
Yuedong Qiu
Also filed as: QIU YUEDONG
4 granted patents·8 citations·filing 2016–2020
65Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP4
Top patents by PatentIndex Score
4 records- 0181US10593641B2Package method and package structure of fan-out chipSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted Mar 17, 2020·4 cites·7 claims
- 0279US10553458B2Chip packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted Feb 4, 2020·4 cites·12 claims
- 0357US10971467B2Packaging method and package structure of fan-out chipSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 6, 2021·0 cites·13 claims
- 0442US10290515B2Wafer level chip packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted May 14, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →