Inventor · disambiguated record
Yurina Sekine
Also filed as: SEKINE YURINA
31 granted patents·7 pending applications·177 citations·filing 2006–2021
96Inventor score
Top patents by PatentIndex Score
38 records- 0198US7803210B2Method for producing spherical particles having nanometer size, crystalline structure, and good sphericityNAPRA CO LTD·Filed 2007·Granted Sep 28, 2010·71 cites·14 claims
- 0297US7842958B1Light-emitting diode, light-emitting device, lighting apparatus, display, and signal lightNAPRA CO LTD·Filed 2010·Granted Nov 30, 2010·36 cites·18 claims
- 0392US10925523B2Microfluidic systems for epidermal sampling and sensingUNIV NORTHWESTERN·Filed 2018·Granted Feb 23, 2021·7 cites·88 claims
- 0488US8217403B1Electronic deviceSEKINE SHIGENOBU·Filed 2011·Granted Jul 10, 2012·10 cites·29 claims
- 0582US8766312B2Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Jul 1, 2014·8 cites·1 claims
- 0682US7910837B2Circuit board, electronic device and method for manufacturing the sameNAPRA CO LTD·Filed 2008·Granted Mar 22, 2011·8 cites·2 claims
- 0780US11883165B2Microfluidic systems for epidermal sampling and sensingUNIV NORTHWESTERN·Filed 2020·Granted Jan 30, 2024·1 cites·28 claims
- 0880US8415784B2Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing methodSEKINE SHIGENOBU·Filed 2010·Granted Apr 9, 2013·5 cites·23 claims
- 0976US9339871B2Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flowNAPRA CO LTD·Filed 2014·Granted May 17, 2016·1 cites·14 claims
- 1075US9704793B2Substrate for electronic device and electronic deviceSEKINE SHIGENOBU·Filed 2011·Granted Jul 11, 2017·4 cites·5 claims
- 1175US9076786B2Wiring substrate and manufacturing method thereforNAPRA CO LTD·Filed 2014·Granted Jul 7, 2015·3 cites·7 claims
- 1275US8377565B2Filling material and filling method using the sameNAPRA CO LTD·Filed 2011·Granted Feb 19, 2013·4 cites·4 claims
- 1373US9691519B2Insulating paste, electronic device and method for forming insulatorNAPRA CO LTD·Filed 2013·Granted Jun 27, 2017·1 cites·2 claims
- 1471US8079131B2Method for filling metal into fine spaceSEKINE SHIGENOBU·Filed 2009·Granted Dec 20, 2011·5 cites·12 claims
- 1571US7781382B2Lubricant composition and bearing structureNAPRA CO LTD·Filed 2006·Granted Aug 24, 2010·1 cites·9 claims
- 1670US8580581B2Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2010·Granted Nov 12, 2013·3 cites·2 claims
- 1769US11786168B2Epidermal sensing systems for optical readout, visualization and analysis of biofluidsUNIV NORTHWESTERN·Filed 2018·Granted Oct 17, 2023·1 cites·41 claims
- 1869US9730325B2Substrate with built-in passive elementNAPRA CO LTD·Filed 2014·Granted Aug 8, 2017·2 cites·6 claims
- 1969US8759211B2Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing methodNAPRA CO LTD·Filed 2013·Granted Jun 24, 2014·2 cites·2 claims
- 2067US9293416B2Functional materialNAPRA CO LTD·Filed 2014·Granted Mar 22, 2016·2 cites·6 claims
- 2165US9685394B2Electronic device and manufacturing method thereforSEKINE SHIGENOBU·Filed 2011·Granted Jun 20, 2017·2 cites·6 claims
- 2258US8758900B2Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the sameSEKINE SHIGENOBU·Filed 2010·Granted Jun 24, 2014·0 cites·6 claims
- 2358US2014023777A1Method for producing wiring board having through hole or non-through holeNAPRA CO LTD·Filed 2013·Application pending·0 cites
- 2457US11577216B2Carbonate apatite with high carbonate contentJAPAN ATOMIC ENERGY AGENCY·Filed 2019·Granted Feb 14, 2023·0 cites·8 claims
- 2555US2023235146A1Gels, Porous Bodies, and Method of Preparing a Gel or a Porous BodyJAPAN ATOMIC ENERGY AGENCY·Filed 2021·Application pending·0 cites
- 2654US11649166B2Process for producing carbonate apatiteJAPAN ATOMIC ENERGY AGENCY·Filed 2020·Granted May 16, 2023·0 cites·7 claims
- 2753US9950925B2Method for forming functional part in minute spaceNAPRA CO LTD·Filed 2017·Granted Apr 24, 2018·0 cites·7 claims
- 2853US9460965B2Semiconductor substrate, eletronic device and method for manufacturing the sameNAPRA CO LTD·Filed 2015·Granted Oct 4, 2016·0 cites·8 claims
- 2952US8569632B2Wiring board having through hole or non-through hole, and method for producing the sameSEKINE SHIGENOBU·Filed 2006·Granted Oct 29, 2013·0 cites·8 claims
- 3052US2011232740A1Solar cellNAPRA CO LTD·Filed 2011·Application pending·0 cites
- 3151US9230860B2Semiconductor substrate, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2012·Granted Jan 5, 2016·0 cites·6 claims
- 3250US8609999B2Circuit board, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Dec 17, 2013·0 cites·10 claims
- 3349US9349720B2Integrated circuit deviceNAPRA CO LTD·Filed 2014·Granted May 24, 2016·0 cites·4 claims
- 3449US8217280B2Circuit board, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Jul 10, 2012·0 cites·9 claims
- 3549US2013136645A1Method for forming functional part in minute spaceNAPRA CO LTD·Filed 2012·Application pending·0 cites
- 3649US2010031501A1Method for filling through hole or non-through hole formed on board with fillerNAPRA CO LTD·Filed 2008·Application pending·0 cites
- 3748US2013250481A1Conductive fine powder, conductive paste and electronic componentNAPRA CO LTD·Filed 2013·Application pending·0 cites
- 3843US2013277850A1Electronic deviceNAPRA CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →