Inventor · disambiguated record
Yuci Shen
Also filed as: SHEN YUCI
10 granted patents·9 pending applications·50 citations·filing 2012–2024
84Inventor score
Files withSHEN YUCI19
Top patents by PatentIndex Score
19 records- 0195US10643924B1Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materialsSHEN YUCI·Filed 2019·Granted May 5, 2020·37 cites·4 claims
- 0293US12381125B1Structural screen window liquid metal thermal interface padSHEN YUCI·Filed 2024·Granted Aug 5, 2025·3 cites·12 claims
- 0391US12040251B13D cooling block for heat dissipation in electronic devicesSHEN YUCI·Filed 2024·Granted Jul 16, 2024·2 cites·16 claims
- 0487US11373931B1Lid allowing for liquid metal thermal interfacing materials in a lidded flip chip packageSHEN YUCI·Filed 2021·Granted Jun 28, 2022·2 cites·16 claims
- 0578US11507017B2Package aspect of heat-dissipating lid and reservoir structure for liquid thermal interfacing materialsSHEN YUCI·Filed 2020·Granted Nov 22, 2022·1 cites·13 claims
- 0676US11177193B2Reservoir structure and system forming gap for liquid thermal interface materialSHEN YUCI·Filed 2020·Granted Nov 16, 2021·1 cites·8 claims
- 0775US9397035B2Integrated ingot for TSV substrates and method for making the sameSHEN YUCI·Filed 2013·Granted Jul 19, 2016·4 cites·20 claims
- 0858US11296010B2Heat sink aspect of heat dissipating lid and reservoir structure flip chip package for liquid thermal interfacing materialsSHEN YUCI·Filed 2020·Granted Apr 5, 2022·0 cites·14 claims
- 0957US2025191996A1Structural Thermal Interface PadSHEN YUCI·Filed 2023·Application pending·0 cites
- 1055US2025062187A1Direct Vapor Chamber for Heat Dissipation in Electronic DevicesSHEN YUCI·Filed 2023·Application pending·0 cites
- 1151US12412803B2Lid allowing for a thermal interface material with fluidity in a lidded flip chip packageSHEN YUCI·Filed 2022·Granted Sep 9, 2025·0 cites·13 claims
- 1250US2023298965A1Lid with Self Sealing Plug Allowing for a Thermal Interface Material with Fluidity in a Lidded Flip Chip PackageSHEN YUCI·Filed 2022·Application pending·0 cites
- 1350US2023413476A1Heat Dissipating Object with Self Sealing Plug Allowing for a Thermal Interface Material with Fluidity for an Electronic DeviceSHEN YUCI·Filed 2022·Application pending·0 cites
- 1449US2023282545A1Lidded Flip Chip Package Allowing for a Thermal Interface Material with FluiditySHEN YUCI·Filed 2022·Application pending·0 cites
- 1539US2014167243A1Semiconductor packages using a chip constraint meansSHEN YUCI·Filed 2012·Application pending·0 cites
- 1638US10685851B2Hybrid-cloth-based method for making TSV substratesSHEN YUCI·Filed 2018·Granted Jun 16, 2020·0 cites·18 claims
- 1738US2014091461A1Die cap for use with flip chip packageSHEN YUCI·Filed 2012·Application pending·0 cites
- 1832US2017135203A1Microelectronic Package Using A Substrate With A Multi-Region Core LayerSHEN YUCI·Filed 2015·Application pending·0 cites
- 1931US2017040247A1Substrate core with effective through substrate vias and method for making the sameSHEN YUCI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →