Inventor · disambiguated record
Yu-Lin Shih
Also filed as: SHIH YU LI · SHIH YU-LIN
15 granted patents·4 pending applications·50 citations·filing 2002–2023
87Inventor score
Files withADVANCED SEMICONDUCTOR ENG12HONGBO WIRELESS COMMUNICATION TECH CO LTD3AVANCE TECHNOLOGIES INC1IND TECH RES INST1SHIH YU LIN1
Top patents by PatentIndex Score
19 records- 0186US6950313B1Interface card fastenerAVANCE TECHNOLOGIES INC·Filed 2004·Granted Sep 27, 2005·44 cites·7 claims
- 0270US10270184B2Control module and multiple-antenna device having the sameHONGBO WIRELESS COMMUNICATION TECH CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·10 claims
- 0368US10332757B2Semiconductor device package having a multi-portion connection elementADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·1 cites·20 claims
- 0461US10079156B2Semiconductor package including dielectric layers defining via holes extending to component padsADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 18, 2018·1 cites·16 claims
- 0560US10135115B2Integrated module having antennaHONGBO WIRELESS COMMUNICATION TECH CO LTD·Filed 2016·Granted Nov 20, 2018·1 cites·10 claims
- 0658US10084228B2System of integrated module with antennaHONGBO WIRELESS COMMUNICATION TECH CO LTD·Filed 2016·Granted Sep 25, 2018·1 cites·7 claims
- 0757US2025214776A1Picking method, picking vehicle and picking systemIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0854US2024088091A1Method for manufacturing a package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0954US2003212706A1Patent management systemFiled 2002·Application pending·0 cites
- 1052US12388001B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 12, 2025·0 cites·14 claims
- 1151US11515270B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 29, 2022·0 cites·12 claims
- 1251US11232993B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 25, 2022·0 cites·17 claims
- 1351US11205628B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 21, 2021·0 cites·17 claims
- 1450US11756904B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 1550US11031274B2Semiconductor device packages and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 8, 2021·0 cites·45 claims
- 1649US10340212B2Semiconductor package structure having a heat dissipation structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 2, 2019·0 cites·23 claims
- 1748US9721799B2Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 1, 2017·0 cites·19 claims
- 1845US10354969B2Substrate structure, semiconductor package including the same, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 16, 2019·0 cites·18 claims
- 1944US2022008274A1Disposable patient isolation hoodSHIH YU LIN·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →