Inventor · disambiguated record
Yuh-Shan Su
Also filed as: SU YUH-SHAN
4 granted patents·1 pending application·4 citations·filing 2019–2025
63Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG5
Top patents by PatentIndex Score
5 records- 0187US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 0282US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0380US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 0471US11721678B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 0550US11430750B2Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layerADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 30, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →