Inventor · disambiguated record
Yu-Chung Su
Also filed as: SU YU-CHUNG
20 granted patents·12 pending applications·44 citations·filing 2013–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC3TAIWAN SEMICONDUCTOR MFG3HON HAI PREC IND CO LTD2
Top patents by PatentIndex Score
32 records- 0194US9812358B1FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·13 cites·20 claims
- 0288US9436086B2Anti-reflective layer and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 6, 2016·5 cites·20 claims
- 0388US9281192B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 0486US11120995B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·3 cites·20 claims
- 0586US9245751B2Anti-reflective layer and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·6 cites·20 claims
- 0682US2025362603A1Photoresist underlayer materials and associated methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0779US9362120B2Lithography process and composition with de-crosslinkable crosslink materialTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 7, 2016·4 cites·20 claims
- 0878US10755927B2Anti-reflective gap filling materials and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 0976US10082734B2Composition and method for lithography patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 25, 2018·2 cites·20 claims
- 1073US2025085631A1Photoresist underlayer materials and associated methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1172US11094541B2Anti-reflective coating materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 1272US10768527B2Resist solvents for photolithography applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 1370US2024253176A1Polishing pad with endpoint windowROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1470US2024253177A1Polishing pad with endpoint detection windowROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1568US2024253175A1Polishing pad with endpoint windowROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1665US9793268B2Method and structure for gap filling improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 17, 2017·1 cites·20 claims
- 1765US9349622B2Method and apparatus for planarization of substrate coatingsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 24, 2016·1 cites·20 claims
- 1861US10163631B2Polymer resin comprising gap filling materials and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 1960US9761449B2Gap filling materials and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 12, 2017·0 cites·20 claims
- 2060US2025259844A1Method of manufacturing a semiconductor device and composition including floating additiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2159US10497574B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 2258US2025183034A1Method of smoothening profile of photoresistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2357US12087616B2Air gap formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 2457US2023161240A1Manufacturing method of euv photo masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2553US11500179B2Imaging lens and electronic device having the sameHON HAI PREC IND CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 2653US11409084B2Lens module including five lenses of −+++− refractive powers, and electronic device using the sameHON HAI PREC IND CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·14 claims
- 2753US2023377883A1System and method for directed self-assembly with high boiling point solventTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2851US10770293B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2951US10515953B2Method and structure for gap filling improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 3050US2023350302A1Polymer crosslink de-crosslink processes for resist patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3147US2016260623A1Method and Apparatus for Planarization of Substrate CoatingsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
- 3234US2016252815A1Photoresist with Floating-OOB-Absorption AdditiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →