Inventor · disambiguated record
Yuya Suto
Also filed as: SUTO YUYA
1 granted patent·5 pending applications·0 citations·filing 2020–2023
11Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0154US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 0253US2025379177A1Al ALLOY BONDING WIRENIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 0345US2024071978A1Al BONDING WIRE FOR SEMICONDUCTOR DEVICESNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 0445US2024110262A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 0545US2024312946A1Ai bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 0643US2023302584A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →