Inventor · disambiguated record
Yukinori Tabira
Also filed as: TABIRA YUKINORI
3 granted patents·2 pending applications·42 citations·filing 2004–2015
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0177US7655506B2Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor packageNEC ELECTRONICS CORP·Filed 2007·Granted Feb 2, 2010·10 cites·10 claims
- 0274US7166919B2Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor packageNEC ELECTRONICS CORP·Filed 2004·Granted Jan 23, 2007·24 cites·11 claims
- 0355US7224045B2Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor packageNEC ELECTRONICS CORP·Filed 2004·Granted May 29, 2007·8 cites·18 claims
- 0432US2016093561A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0532US2010311234A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →