Inventor · disambiguated record
Yuusuke Takano
Also filed as: TAKANO YUUSUKE
13 granted patents·9 pending applications·18 citations·filing 2011–2024
85Inventor score
Top patents by PatentIndex Score
22 records- 0187US11302675B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2020·Granted Apr 12, 2022·2 cites·8 claims
- 0279US9349694B2Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2014·Granted May 24, 2016·5 cites·5 claims
- 0379US9209053B2Manufacturing method of a conductive shield layer in semiconductor deviceTOSHIBA KK·Filed 2014·Granted Dec 8, 2015·7 cites·10 claims
- 0468US11705436B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Granted Jul 18, 2023·0 cites·15 claims
- 0567US9824905B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA MEMORY CORP·Filed 2014·Granted Nov 21, 2017·0 cites·20 claims
- 0666US9385090B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2014·Granted Jul 5, 2016·2 cites·11 claims
- 0764US10115674B2Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 30, 2018·1 cites·12 claims
- 0863US9881876B2Semiconductor device having conductive shield layerTOSHIBA MEMORY CORP·Filed 2016·Granted Jan 30, 2018·1 cites·18 claims
- 0962US2025201616A1Semiconductor manufacturing device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1059US2024321830A1Manufacturing method of semiconductor device and semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1154US11715701B2Semiconductor device and method of inspecting the sameTOSHIBA MEMORY CORP·Filed 2019·Granted Aug 1, 2023·0 cites·17 claims
- 1252US2015070046A1Semiconductor device and method of inspecting the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1351US2024203901A1Semiconductor device and method of producing the sameKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1446US9458535B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA KK·Filed 2014·Granted Oct 4, 2016·0 cites·18 claims
- 1545US10312197B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2014·Granted Jun 4, 2019·0 cites·19 claims
- 1643US2015170988A1Method of manufacturing semiconductor apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1741US10546818B2Semiconductor package including titanium oxide layer and method for manufacturing the sameTOSHIBA MEMORY CORP·Filed 2017·Granted Jan 28, 2020·0 cites·17 claims
- 1840US2015171056A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1939US2014366125A1Information processing device, external device, server device, information processing method, information processing program and systemPIONEER CORP·Filed 2011·Application pending·0 cites
- 2037US2014366124A1Determination device, determination method and determination programTAKEHARA YOZO·Filed 2011·Application pending·0 cites
- 2137US2012077313A1Semiconductor device manufacturing methodHOMMA SOICHI·Filed 2011·Application pending·0 cites
- 2236US9646908B2Method for manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2016·Granted May 9, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →