Inventor · disambiguated record
Yukihiro Takao
Also filed as: TAKAO YUKIHIRO
19 granted patents·2 pending applications·833 citations·filing 1997–2010
96Inventor score
Top patents by PatentIndex Score
21 records- 0198US6864172B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Mar 8, 2005·319 cites·23 claims
- 0296US7662670B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Feb 16, 2010·61 cites·21 claims
- 0395US7399683B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 15, 2008·33 cites·28 claims
- 0492US7101735B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Sep 5, 2006·57 cites·19 claims
- 0591US7508072B2Semiconductor device with pad electrode for testing and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Mar 24, 2009·19 cites·13 claims
- 0691US7371693B2Manufacturing method of semiconductor device with chamferingSANYO ELECTRIC CO·Filed 2004·Granted May 13, 2008·40 cites·8 claims
- 0791US6326701B1Chip size package and manufacturing method thereofSANYO ELECTRIC CO·Filed 2000·Granted Dec 4, 2001·74 cites·9 claims
- 0890US7719102B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2008·Granted May 18, 2010·13 cites·23 claims
- 0988US7919875B2Semiconductor device with recess portion over pad electrodeSANYO ELECTRIC CO·Filed 2007·Granted Apr 5, 2011·16 cites·4 claims
- 1086US6674162B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2001·Granted Jan 6, 2004·43 cites·3 claims
- 1181US8101496B2Method of manufacturing ball grid array type semiconductor deviceTAKAO YUKIHIRO·Filed 2010·Granted Jan 24, 2012·7 cites·14 claims
- 1281US7745931B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Jun 29, 2010·27 cites·9 claims
- 1380US7622810B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2003·Granted Nov 24, 2009·29 cites·10 claims
- 1475US7575994B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Aug 18, 2009·7 cites·4 claims
- 1573US7312107B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Dec 25, 2007·17 cites·13 claims
- 1671US6329288B1Semiconductor device and manufacturing method thereofSANYO EELCTRIC CO LTD·Filed 2000·Granted Dec 11, 2001·22 cites·13 claims
- 1766US5913434ARetortable containerOTSUKA PHARAMACEUTAICAL CO LTD·Filed 1997·Granted Jun 22, 1999·43 cites·7 claims
- 1863US7981807B2Manufacturing method of semiconductor device with smoothingSANYO ELECTRIC CO·Filed 2008·Granted Jul 19, 2011·0 cites·9 claims
- 1955US7579671B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Aug 25, 2009·6 cites·6 claims
- 2042US2006289991A1Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2130US2002096757A1Semiconductor device and method of manufacturing the sameFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →