Inventor · disambiguated record
Yuichiro Takeshima
Also filed as: TAKESHIMA YUICHIRO
9 granted patents·9 pending applications·5 citations·filing 2012–2024
77Inventor score
Technology areasH10P
Top patents by PatentIndex Score
18 records- 0178US11664275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 30, 2023·1 cites·9 claims
- 0277US12154826B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 0376US2025022753A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0472US9023429B2Method of manufacturing semiconductor device and substrate processing apparatusTAKESHIMA YUICHIRO·Filed 2012·Granted May 5, 2015·4 cites·11 claims
- 0556US2024243019A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0656US2024194476A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0755US12040161B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 0855US2024087927A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0954US11908682B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1052US2022415700A1Substrate processing apparatus, substrate mounting table cover, method of manufacturing semiconductor device and non-transitory computer readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1151US2023201889A1Cleaning method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1250US2023097621A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1348US2022301863A1Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1447US11081362B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·17 claims
- 1547US10796900B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·0 cites·15 claims
- 1646US2022139675A1Method of Manufacturing Semiconductor Device, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1743US11189483B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 1842US11152476B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Yuichiro Takeshima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →