Inventor · disambiguated record
Yuma Takeuchi
Also filed as: TAKEUCHI YUMA
3 granted patents·2 pending applications·0 citations·filing 2016–2023
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0164US11873414B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 0250US11186742B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 30, 2021·0 cites·16 claims
- 0348US2025385104A1Production method for semiconductor packagesRESONAC CORP·Filed 2022·Application pending·0 cites
- 0446US2025326926A1Resin composition for molding, and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0530US12269943B2Liquid resin composition for sealing and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 8, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →