Inventor · disambiguated record
Yuki Takiguchi
Also filed as: TAKIGUCHI YUKI
9 granted patents·5 pending applications·0 citations·filing 2005–2022
73Inventor score
Top patents by PatentIndex Score
14 records- 0159US10435510B2Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminateKANEKA CORP·Filed 2014·Granted Oct 8, 2019·0 cites·11 claims
- 0249US2025380446A1Nitride semiconductor device and method of manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0348US10626218B2Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminateKANEKA CORP·Filed 2019·Granted Apr 21, 2020·0 cites·9 claims
- 0447US12494404B2Semiconductor device including stop islands and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 9, 2025·0 cites·14 claims
- 0546US11239323B2Oxide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Feb 1, 2022·0 cites·10 claims
- 0645US12476165B2Nitride semiconductor device, and method of manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Nov 18, 2025·0 cites·12 claims
- 0744US12349390B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 0844US10308767B2Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing methodKANEKA CORP·Filed 2015·Granted Jun 4, 2019·0 cites·11 claims
- 0943US2024234575A9Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1042US11961765B2Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrateMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 16, 2024·0 cites·10 claims
- 1142US2023120994A1Polishing method, and semiconductor substrate manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1242US2007250157A1Stent For Placement In BodyKANEKA CORP·Filed 2005·Application pending·0 cites
- 1341US2024266429A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1439US11222985B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 11, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →