Inventor · disambiguated record
Yujuan Tao
Also filed as: TAO YUJUAN
15 granted patents·8 pending applications·19 citations·filing 2006–2025
86Inventor score
Files withTONGFU MICROELECTRONICS CO LTD5NANTONG FUJITSU MICROELECT CO4SHI LEI4TAO YUJUAN4NANTONG TONGFU MICROELECTRONICS CO LTD3
Top patents by PatentIndex Score
23 records- 0187US9548282B2Metal contact for semiconductor deviceNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Jan 17, 2017·10 cites·6 claims
- 0280US2025293132A1Chip packaging method and chip packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0380US2025293049A1Fan-out chip packaging methodTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0480US2025293209A1Chip packaging method and chip packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0575US12438098B2Packaging structure and fabrication method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Oct 7, 2025·1 cites·16 claims
- 0675US2025372532A1Packaging structureNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0774US9397070B2Method for forming package structureNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Jul 19, 2016·4 cites·10 claims
- 0870US9485868B2Package structureNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Nov 1, 2016·3 cites·12 claims
- 0953US9324583B2Packaging methodSHI LEI·Filed 2012·Granted Apr 26, 2016·1 cites·19 claims
- 1048US10515883B23D system-level packaging methods and structuresTONGFU MICROELECTRONICS CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·9 claims
- 1146US9287205B2Fan-out high-density packaging methods and structuresNANTONG FUJITSU MICROELECT CO·Filed 2015·Granted Mar 15, 2016·0 cites·15 claims
- 1246US9040347B2Fan-out high-density packaging methods and structuresTAO YUJUAN·Filed 2012·Granted May 26, 2015·0 cites·15 claims
- 1345US9595490B23D system-level packaging methods and structuresTAO YUJUAN·Filed 2012·Granted Mar 14, 2017·0 cites·19 claims
- 1443US2022246540A1Packaging structure and formation method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1541US9362173B2Method for chip packageSHI LEI·Filed 2011·Granted Jun 7, 2016·0 cites·17 claims
- 1641US8883627B2Method for chip packagingSHI LEI·Filed 2011·Granted Nov 11, 2014·0 cites·20 claims
- 1741US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 1841US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 1940US2008285251A1Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameJIANGSU CHANGIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 2039US9099448B2Three-dimensional system-level packaging methods and structuresTAO YUJUAN·Filed 2012·Granted Aug 4, 2015·0 cites·20 claims
- 2137US9543269B2System-level packaging methods and structuresTAO YUJUAN·Filed 2012·Granted Jan 10, 2017·0 cites·12 claims
- 2236US10741499B2System-level packaging structuresTONGFU MICROELECTRONICS CO LTD·Filed 2016·Granted Aug 11, 2020·0 cites·12 claims
- 2335US9497862B2Packaging structureSHI LEI·Filed 2012·Granted Nov 15, 2016·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →