Inventor · disambiguated record
Yun Chen Teng
Also filed as: TENG YUN · TENG YUN CHEN
16 granted patents·14 pending applications·5 citations·filing 2016–2025
87Inventor score
Top patents by PatentIndex Score
30 records- 0196US11908708B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·3 cites·20 claims
- 0294US11855040B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0383US12347696B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0481US12327811B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0580US12283622B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 0680US2025293052A1Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0780US2025359147A1Bottom dielectric isolation and methods of forming the same in field-effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025273624A1Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US2025323206A1Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US2024379616A1Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1174US2024387445A1Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1270US12266574B2Flowable chemical vapor deposition (FCVD) using multi-step anneal treatment and devices thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1370US12249592B2Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 1470US12230532B2Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 1570US11728406B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 1669US2025204019A1Flowable chemical vapor deposition (fcvd) using multi-step anneal treatment and devices thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1767US12237211B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 1866US12255171B2Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 1966US2023282751A1Bottom dielectric isolation and methods of forming the same in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2065US2025149378A1Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2164US12368129B2Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 2261US10868137B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 2360US2025246478A1Protection of sti featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2457US2024405096A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2551US11183426B2Method for forming a FinFET structure that prevents or reduces deformation of adjacent finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 2651US2024055480A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2749US2025372370A1Deposition Process for Dielectric LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2844US10526668B2Streptomyces and method for producing milbemycin A4 using sameZHEJIANG HISUN PHARM CO LTD·Filed 2016·Granted Jan 7, 2020·0 cites·10 claims
- 2944US10287545B2Streptomyces and method for producing milbemycin A3 using sameZHEJIANG HISUN PHARM CO LTD·Filed 2016·Granted May 14, 2019·0 cites·11 claims
- 3033US2019152986A1Crystal form a of milbemycin a3 oxime and preparation method thereofZHEJIANG HISUN PHARM CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →