Inventor · disambiguated record
Yuki Terado
Also filed as: TERADO YUKI
2 granted patents·1 pending application·0 citations·filing 2021–2023
23Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0154US2024258254A1Bonding pad, integrated circuit element, and integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0252US11798869B2Semiconductor package with plurality of grooves on lower surfaceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Oct 24, 2023·0 cites·8 claims
- 0346US11990894B2Semiconductor element driving circuit and semiconductor element driving deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted May 21, 2024·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →