Inventor · disambiguated record
Yuka Terai
Also filed as: TERAI YUKA
11 granted patents·2 pending applications·283 citations·filing 1991–2013
92Inventor score
Top patents by PatentIndex Score
13 records- 0186US5501739AApparatus and method for forming thin filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Mar 26, 1996·46 cites·9 claims
- 0281US5863338AApparatus and method for forming thin filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jan 26, 1999·36 cites·20 claims
- 0380US5576247AThin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moistureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Nov 19, 1996·71 cites·3 claims
- 0469US5693557AMethod of fabricating a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Dec 2, 1997·29 cites·4 claims
- 0564US5633211ASemiconductor device and processMATSUSHITA ELECTRIC IND CO LD·Filed 1994·Granted May 27, 1997·37 cites·14 claims
- 0658US5474949AMethod of fabricating capacitor or contact for semiconductor device by forming uneven oxide film and reacting silicon with metal containing gasMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Dec 12, 1995·22 cites·6 claims
- 0757US7171640B2System and method for operation verification of semiconductor integrated circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 30, 2007·1 cites·10 claims
- 0857US2013075851A1Solid-state imaging devicePANASONIC CORP·Filed 2012·Application pending·0 cites
- 0950US5314848AMethod for manufacturing a semiconductor device using a heat treatment according to a temperature profile that prevents grain or particle precipitation during reflowMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted May 24, 1994·20 cites·11 claims
- 1045US5661068AMethod of fabricating a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 26, 1997·9 cites·5 claims
- 1145US2013242149A1Solid-state imaging element and method for manufacturing samePANASONIC CORP·Filed 2013·Application pending·0 cites
- 1239US6372928B1Layer forming material and wiring forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 16, 2002·7 cites·1 claims
- 1336US5773639ALayer forming material and wiring forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 30, 1998·5 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →