Inventor · disambiguated record
Yu-Hsuan Tsai
Also filed as: TSAI YU-HSUAN
13 granted patents·7 pending applications·9 citations·filing 2002–2024
85Inventor score
Files withADVANCED SEMICONDUCTOR ENG13DELTA ELECTRONICS INC4KINGPAK TECH INC1TAIWAN SEMICONDUCTOR MFG1UNIV NAT KAOHSIUNG APPLIED SCI1
Top patents by PatentIndex Score
20 records- 0179US10804413B1Package componentKINGPAK TECH INC·Filed 2019·Granted Oct 13, 2020·1 cites·9 claims
- 0278US11081413B2Semiconductor package with inner and outer cavitiesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 0377US10224298B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·2 cites·19 claims
- 0470US10526200B2Semiconductor device package including cover including tilted inner sidewallADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 7, 2020·1 cites·18 claims
- 0568US10720751B2Optical package structure, optical module, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jul 21, 2020·1 cites·21 claims
- 0664US2020140262A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0763US11101189B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 24, 2021·0 cites·18 claims
- 0861US10170658B2Semiconductor package structures and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 1, 2019·1 cites·21 claims
- 0959US2025157863A1Power moduleDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1058US2025149347A1Method for fabricating semiconductor packaging structure and semiconductor packaging structure fabricated using the sameDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1158US2024429143A1Power module structureDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1257US10734337B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
- 1355US10689248B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1451US9850124B2Semiconductor device package for reducing parasitic light and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 26, 2017·0 cites·13 claims
- 1550US2020206735A1Detection method, device and cartridge for enhancing detection signal intensityDELTA ELECTRONICS INC·Filed 2019·Application pending·0 cites
- 1649US11565934B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 1743US11174157B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 16, 2021·0 cites·16 claims
- 1840US10841679B2Microelectromechanical systems package structureADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 17, 2020·0 cites·36 claims
- 1934US2003139847A1Visually enhanced intelligent article tracking systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 2029US2016189879A1Dye-Sensitized Solar Cell Structure and Manufacturing Method ThereofUNIV NAT KAOHSIUNG APPLIED SCI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →