Inventor · disambiguated record
Yu-Shih Wang
Also filed as: WANG YU SHIH · WANG YU SHIH SHIH
54 granted patents·21 pending applications·86 citations·filing 2003–2025
97Inventor score
Top patents by PatentIndex Score
75 records- 0196US11703914B2Portable electronic device with at least one external displayACER INC·Filed 2022·Granted Jul 18, 2023·4 cites·10 claims
- 0295US11557512B2Wet cleaning with tunable metal recess for via plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·3 cites·20 claims
- 0393US10361120B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·8 cites·20 claims
- 0491US11631951B2Plug electrical connector and receptacle electrical connectorACER INC·Filed 2021·Granted Apr 18, 2023·2 cites·10 claims
- 0591US10037918B2Contact structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·7 cites·20 claims
- 0689US11164789B1Method for forming semiconductor device that includes covering metal gate with multilayer dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·2 cites·20 claims
- 0788US11488857B2Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·2 cites·20 claims
- 0887US10879656B2Plug connectorACER INC·Filed 2019·Granted Dec 29, 2020·7 cites·9 claims
- 0986US12066871B2Portable electronic deviceACER INC·Filed 2022·Granted Aug 20, 2024·1 cites·10 claims
- 1086US11681329B2Electronic device assemblyACER INC·Filed 2022·Granted Jun 20, 2023·1 cites·3 claims
- 1186US2025364420A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1285US2025300009A1Wet Cleaning with Tunable Metal Recess for Via PlugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1383US11488859B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·3 cites·20 claims
- 1483US11276571B2Method of breaking through etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·1 cites·20 claims
- 1583US10475702B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·20 claims
- 1683US2024379433A1Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1783US2024371688A1Semiconductor device with doped region dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1882US9535466B2Electronic assemblyACER INC·Filed 2015·Granted Jan 3, 2017·4 cites·14 claims
- 1982US2025336719A1Semiconductor device with doped region dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2081US12381081B2Method of breaking through etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 2180US11009974B2Touch pad structureACER INC·Filed 2020·Granted May 18, 2021·1 cites·11 claims
- 2279US11340659B2Electronic deviceACER INC·Filed 2020·Granted May 24, 2022·1 cites·8 claims
- 2378US12394669B2Wet cleaning with tunable metal recess for via plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2478US12136566B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 2578US12051619B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·20 claims
- 2678US12020981B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 2778US11334115B2Electronic device assemblyACER INC·Filed 2020·Granted May 17, 2022·1 cites·6 claims
- 2877US11157046B2Electronic deviceACER INC·Filed 2020·Granted Oct 26, 2021·1 cites·8 claims
- 2976US12469789B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 3076US9748720B2Transmission shaft set, transmission shaft structure and metal pin connecting shaftACER INC·Filed 2014·Granted Aug 29, 2017·7 cites·8 claims
- 3175US12272598B2Conductive feature of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 3275US2025201627A1Conductive feature of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3374US12105562B2Portable electronic device with at least one external displayACER INC·Filed 2023·Granted Oct 1, 2024·0 cites·10 claims
- 3474US11901180B2Method of breaking through etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3574US2024297074A1Conductive Feature Formation and StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3673US12482705B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 3771US11798843B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 3870US12038793B2Electronic device and hinge mechanism thereofACER INC·Filed 2022·Granted Jul 16, 2024·0 cites·9 claims
- 3970US11996324B2Conductive feature of a semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 4070US11656696B2Touch pad structureACER INC·Filed 2022·Granted May 23, 2023·0 cites·10 claims
- 4169US12224204B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 4269US11817330B2Method for processing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 4368US11532446B2Button structure of input deviceACER INC·Filed 2021·Granted Dec 20, 2022·0 cites·6 claims
- 4468US6937205B2Integral structure including an antenna and a shielding cover and wireless module thereofUNIWILL COMP CORP·Filed 2003·Granted Aug 30, 2005·22 cites·17 claims
- 4567US11587875B2Connecting structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 4667US11282750B2Contact structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 4767US10431937B1Electric connector for electronic deviceACER INC·Filed 2018·Granted Oct 1, 2019·2 cites·8 claims
- 4866US10943823B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·20 claims
- 4965US11398391B2Substrate processing apparatus and method for processing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 5065US11314343B2Touch pad structureACER INC·Filed 2021·Granted Apr 26, 2022·0 cites·10 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →