Inventor · disambiguated record
Yu-Sheng Wang
Also filed as: WANG YU-SHENG
67 granted patents·16 pending applications·148 citations·filing 1994–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD55QUANTA STORAGE INC6TAIWAN SEMICONDUCTOR MFG5ASUSTEK COMP INC2CHANG SHIH-CHIEH2
Top patents by PatentIndex Score
83 records- 0196US12021147B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0295US10985061B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·8 cites·20 claims
- 0395US10510851B2Low resistance contact method and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·10 cites·20 claims
- 0495US10483165B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·8 cites·20 claims
- 0594US10186456B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·8 cites·20 claims
- 0693US11563120B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·20 claims
- 0793US10833196B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·5 cites·20 claims
- 0891US9947753B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 17, 2018·6 cites·15 claims
- 0989US9837507B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·5 cites·16 claims
- 1088US10516034B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 1188US10153203B2Methods for forming metal layers in openings and apparatus for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·8 cites·20 claims
- 1287US10714576B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
- 1387US8247322B2Via/contact and damascene structures and manufacturing methods thereofCHANG SHIH-CHIEH·Filed 2007·Granted Aug 21, 2012·14 cites·16 claims
- 1485US2024363409A1Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1584US10157785B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 1683US10804161B2CMOS FinFET structures including work-function materials having different proportions of crystalline orientations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 13, 2020·3 cites·20 claims
- 1783US2025361602A1Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1882US10867845B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·14 claims
- 1981US12507458B2Semiconductor device with dielectric spacer liner on source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2081US6452201B1Wafer-mapping method of wafer load port equipmentIND TECH RES INST·Filed 2000·Granted Sep 17, 2002·27 cites·8 claims
- 2180US12356656B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 2279US10157998B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 2378US10755938B2Metal gate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·2 cites·20 claims
- 2478US9870995B2Formation of copper layer structure with self anneal strain improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·20 claims
- 2576US8531036B2Via/contact and damascene structuresCHANG SHIH-CHIEH·Filed 2012·Granted Sep 10, 2013·3 cites·19 claims
- 2675US8060897B2Restraining device of optical disk driveWANG YU-SHENG·Filed 2008·Granted Nov 15, 2011·3 cites·8 claims
- 2775US2024360548A1Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2874US11961768B2CMOS FinFET structures including work-function materials having different proportions of crystalline orientations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 16, 2024·0 cites·18 claims
- 2973US12068197B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 3073US11616132B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 3173US10714329B2Pre-clean for contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·20 claims
- 3273US8628998B2Annealing methods for backside illumination image sensor chipsLIN YU-TING·Filed 2012·Granted Jan 14, 2014·3 cites·16 claims
- 3373US2024249977A1Metal adhesion layer to promote metal plug adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3472US10497811B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 3, 2019·1 cites·20 claims
- 3571US11670690B2Semiconductor device with dielectric spacer liner on source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 3670US8356311B2Detecting method for limit switch of optical disc drive by sampling voltage of limit switch predetermined timesQUANTA STORAGE INC·Filed 2011·Granted Jan 15, 2013·2 cites·10 claims
- 3768US10749278B2Method of electroplating metal into recessed feature and electroplating layer in recessed featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·20 claims
- 3868US8470390B2Oxidation-free copper metallization process using in-situ bakingWANG YU-SHENG·Filed 2008·Granted Jun 25, 2013·3 cites·20 claims
- 3967US11682589B2CMOS finFET structures including work-function materials having different proportions of crystalline orientations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·20 claims
- 4067US11031486B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·18 claims
- 4166US12065731B2Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 4266US7417321B2Via structure and process for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 26, 2008·4 cites·16 claims
- 4364US11955379B2Metal adhesion layer to promote metal plug adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·21 claims
- 4464US10147799B2Method of fabricating tantalum nitride barrier layer and semiconductor device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 4, 2018·1 cites·20 claims
- 4564US9735231B2Block layer in the metal gate of MOS devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·1 cites·20 claims
- 4662US9991124B2Metal gate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 5, 2018·0 cites·19 claims
- 4762US9396953B2Conformity control for metal gate stackTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·1 cites·20 claims
- 4861US11271103B2Semiconductor device and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 4960US10497615B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 5059US12300729B2Low resistant contact method and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 13, 2025·0 cites·20 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →