Inventor · disambiguated record
Yu-Po Wang
Also filed as: WANG YU · WANG YU P · WANG YU-PO
43 granted patents·42 pending applications·461 citations·filing 2000–2025
98Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD62WINBOND ELECTRONICS CORP4BAOTOU JINSHAN MAGNETIC MAT CO LTD3MOTOROLA INC2BAOTOU RES INST RARE EARTHS1
Top patents by PatentIndex Score
85 records- 0196US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 0293US7732913B2Semiconductor package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jun 8, 2010·71 cites·12 claims
- 0392US7423340B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 9, 2008·25 cites·12 claims
- 0490US7816187B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 19, 2010·16 cites·14 claims
- 0588US7564140B2Semiconductor package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Jul 21, 2009·17 cites·12 claims
- 0688US6432546B1Microelectronic piezoelectric structure and method of forming the sameMOTOROLA INC·Filed 2000·Granted Aug 13, 2002·43 cites·16 claims
- 0785US11631675B2Semiconductor memory structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 18, 2023·2 cites·16 claims
- 0885US6884652B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Apr 26, 2005·35 cites·12 claims
- 0983US8183092B2Method of fabricating stacked semiconductor structureHUANG CHIEN-PING·Filed 2010·Granted May 22, 2012·6 cites·14 claims
- 1083US7679178B2Semiconductor package on which a semiconductor device can be stacked and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Mar 16, 2010·11 cites·26 claims
- 1183US7629199B2Method for fabricating semiconductor package with build-up layers formed on chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 8, 2009·10 cites·12 claims
- 1283US7342318B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 11, 2008·10 cites·14 claims
- 1382US7808110B2Semiconductor package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 5, 2010·12 cites·16 claims
- 1482US6610560B2Chip-on-chip based multi-chip module with molded underfill and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 26, 2003·45 cites·9 claims
- 1581US6482538B2Microelectronic piezoelectric structure and method of forming the sameMOTOROLA INC·Filed 2001·Granted Nov 19, 2002·25 cites·14 claims
- 1679US9356008B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 1779US7205674B2Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Apr 17, 2007·24 cites·6 claims
- 1878US12412820B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 1978US12412819B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·9 claims
- 2078US8901729B2Semiconductor package, packaging substrate and fabrication method thereofCHEN CHIA-YIN·Filed 2012·Granted Dec 2, 2014·6 cites·12 claims
- 2176US7939383B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted May 10, 2011·6 cites·16 claims
- 2276US2025098156A1Method for forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2375US7354796B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Apr 8, 2008·5 cites·14 claims
- 2474US2025038113A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2573US2025087601A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2671US2025279375A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 2770US12176291B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·18 claims
- 2869US12438094B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·16 claims
- 2969US12334452B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 3067US12199047B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·6 claims
- 3167US12193221B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jan 7, 2025·0 cites·10 claims
- 3267US12051641B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·9 claims
- 3367US8304665B2Package substrate having landless conductive tracesCHANG CHIANG-CHENG·Filed 2008·Granted Nov 6, 2012·3 cites·12 claims
- 3464US6819565B2Cavity-down ball grid array semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 16, 2004·15 cites·10 claims
- 3564US6750533B2Substrate with dam bar structure for smooth flow of encapsulating resinSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jun 15, 2004·13 cites·15 claims
- 3664US2023174389A1Multi-element positive electrode material, and preparation method therefor and application thereofBEIJING EASPRING MAT TECH CO LTD·Filed 2022·Application pending·0 cites
- 3761US11705256B2Neodymium-iron-boron permanent magnet and preparation method and use thereofBAOTOU JINSHAN MAGNETIC MAT CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·11 claims
- 3861US2025132221A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 3960US2025293113A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4060US2025183239A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4159US7361846B2High electrical performance semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Apr 22, 2008·9 cites·13 claims
- 4259US7271493B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 18, 2007·1 cites·11 claims
- 4359US2025246586A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4459US2025336739A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4558US2025266314A1Manufacturing method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4658US2025140765A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4758US2025105068A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4857US2025102750A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 4957US2025364339A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 5055US2025279347A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →