Inventor · disambiguated record
Yung-Chih Wang
Also filed as: WANG YUNG-CHIH
56 granted patents·9 pending applications·130 citations·filing 2006–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD33ACER INC18DARFON ELECTRONICS CORP9TAIWAN SEMICONDUCTOR MFG2DARFON ELECTRONICS1
Top patents by PatentIndex Score
65 records- 0197US10431402B2Button switch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·19 cites·24 claims
- 0295US9390965B2Air-gap forming techniques for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 12, 2016·12 cites·20 claims
- 0394US11842962B2Interconnect structure with air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·1 cites·20 claims
- 0494US9835382B2Thermal dissipation moduleACER INC·Filed 2016·Granted Dec 5, 2017·5 cites·18 claims
- 0591US10276498B2Interconnect structure with air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 0691US10109519B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 23, 2018·7 cites·20 claims
- 0791US9716035B2Combination interconnect structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 25, 2017·11 cites·17 claims
- 0890US11108393B2Optical keyswitch triggered by support mechanism having at least one rotatable frame enable a protrusion to move along with a key capDARFON ELECTRONICS CORP·Filed 2019·Granted Aug 31, 2021·7 cites·17 claims
- 0990US10303212B2Rotary combination module for tablet computerACER INC·Filed 2016·Granted May 28, 2019·8 cites·11 claims
- 1089US10991618B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·4 cites·20 claims
- 1189US10930451B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2019·Granted Feb 23, 2021·4 cites·22 claims
- 1288US10637470B2Optical keyswitchDARFON ELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·6 cites·22 claims
- 1387US10572018B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2018·Granted Feb 25, 2020·4 cites·9 claims
- 1486US10563926B2Lattice boiler evaporatorACER INC·Filed 2017·Granted Feb 18, 2020·2 cites·9 claims
- 1585US11852420B2Thermal dissipation moduleACER INC·Filed 2023·Granted Dec 26, 2023·0 cites·1 claims
- 1685US11764106B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·1 cites·20 claims
- 1785US10634435B2Thermal dissipation moduleACER INC·Filed 2017·Granted Apr 28, 2020·1 cites·17 claims
- 1884US12392560B2Thermal dissipation moduleACER INC·Filed 2023·Granted Aug 19, 2025·0 cites·1 claims
- 1983US9633897B2Air-gap forming techniques for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·2 cites·20 claims
- 2083US8975749B2Method of making a semiconductor device including barrier layers for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 10, 2015·5 cites·20 claims
- 2183US2024387729A1Method of modulating stress of dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2281US12230534B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 2381US11379021B2Heat dissipation moduleACER INC·Filed 2019·Granted Jul 5, 2022·2 cites·9 claims
- 2480US10700005B2Interconnect structure with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 2579US12125911B2Method of modulating stress of dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 2679US9455178B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·4 cites·20 claims
- 2779US8653664B2Barrier layers for copper interconnectLIU NAI-WEI·Filed 2010·Granted Feb 18, 2014·6 cites·20 claims
- 2878US10642322B2Heat dissipation moduleACER INC·Filed 2016·Granted May 5, 2020·2 cites·6 claims
- 2977US10006471B2Fan module and electronic device using the sameACER INC·Filed 2016·Granted Jun 26, 2018·2 cites·20 claims
- 3077US9875967B2Interconnect structure with air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 23, 2018·1 cites·20 claims
- 3176US12094946B2Gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 3276US11495539B2Interconnect structure with air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 3376US11018667B2Optical keyswitchDARFON ELECTRONICS CORP·Filed 2019·Granted May 25, 2021·2 cites·19 claims
- 3476US9583434B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 28, 2017·2 cites·20 claims
- 3575US12051646B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 3675US10325993B2Gate all around device and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·1 cites·20 claims
- 3774US11609048B2Thermal dissipation moduleACER INC·Filed 2020·Granted Mar 21, 2023·0 cites·4 claims
- 3874US10923424B2Interconnect structure with air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 16, 2021·0 cites·20 claims
- 3973US11402157B2Lattice boiler evaporatorACER INC·Filed 2019·Granted Aug 2, 2022·1 cites·6 claims
- 4072US11502196B2Stress modulation for dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 4171US11302792B2Fabrication of gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 4270US9564396B2Semiconductor device and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·2 cites·20 claims
- 4368US10114434B2Heat dissipation module and electronic deviceACER INC·Filed 2016·Granted Oct 30, 2018·1 cites·13 claims
- 4466US11101216B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 4564US10795447B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2019·Granted Oct 6, 2020·0 cites·17 claims
- 4664US10763337B2Fabrication of gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 4764US2017074596A1Thermal dissipation moduleACER INC·Filed 2016·Application pending·0 cites
- 4862US10720526B2Stress modulation for dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 4961US10622453B2Vertical MOS transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 5060US10866640B2Adjusting method applied to a keyswitch for adjusting tactile feedbackDARFON ELECTRONICS CORP·Filed 2018·Granted Dec 15, 2020·0 cites·10 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →