Inventor · disambiguated record
Yu-Ju Wang
Also filed as: WANG YU-JU
0 granted patents·4 pending applications·0 citations·filing 2003–2003
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0132US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 0232US2003160316A1Open-type multichips stack packagingFiled 2003·Application pending·0 cites
- 0331US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 0430US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →