Inventor · disambiguated record
Yung-Hui Wang
Also filed as: WANG YUNG-HUI
19 granted patents·22 pending applications·209 citations·filing 2002–2024
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG17PANJIT INT INC6PATEN WIRELESS TECHNOLOGY INC6WANG YUNG-HUI4PATENT WIRELESS TECHNOLOGY INC2
Top patents by PatentIndex Score
41 records- 0192US7586184B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 8, 2009·29 cites·19 claims
- 0284US8987734B2Semiconductor wafer, semiconductor process and semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Mar 24, 2015·6 cites·17 claims
- 0384US7523551B2Manufacturing method of a multi-layer circuit board embedded with a passive componentADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Apr 28, 2009·17 cites·15 claims
- 0484US7338892B2Circuit carrier and manufacturing process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Mar 4, 2008·15 cites·10 claims
- 0584US6861603B1Structure of button for electronic productPATEN WIRELESS TECHNOLOGY INC·Filed 2003·Granted Mar 1, 2005·29 cites·8 claims
- 0681US6909421B2Wireless input devicePATEN WIRELESS TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·36 cites·9 claims
- 0780US11300727B2Optical communication package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 12, 2022·2 cites·20 claims
- 0874US9253887B2Fabrication method of embedded chip substrateWANG YUNG-HUI·Filed 2012·Granted Feb 2, 2016·3 cites·7 claims
- 0972US6797905B1Rocker switchZIPPY TECH CORP·Filed 2003·Granted Sep 28, 2004·20 cites·4 claims
- 1072US6670566B1Tact switchSHIN JIUH CORP·Filed 2002·Granted Dec 30, 2003·17 cites·10 claims
- 1170US11774673B2Optical communication package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 3, 2023·0 cites·7 claims
- 1269US8099865B2Method for manufacturing a circuit board having an embedded component thereinWANG YUNG HUI·Filed 2008·Granted Jan 24, 2012·5 cites·18 claims
- 1367US7187361B2Wireless portable input device and receiver of the samePATEN WIRELESS TECHNOLOGY INC·Filed 2003·Granted Mar 6, 2007·13 cites·8 claims
- 1463US7506435B2Manufacturing method of a multi-layer circuit board with an embedded passive componentADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 24, 2009·4 cites·16 claims
- 1563US7012208B2Thin switchZIPPY TECH CORP·Filed 2003·Granted Mar 14, 2006·11 cites·6 claims
- 1662US8000107B2Carrier with embedded component and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 16, 2011·2 cites·20 claims
- 1760US2025218927A1Flat packagePANJIT INT INC·Filed 2024·Application pending·0 cites
- 1858US2025201752A1Semiconductor package structure and byproduct of semiconductor componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1957US12224228B2Packaged component with composite pin structure and manufacturing method thereofPANJIT INT INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 2055US2024355716A1Side-wettable semiconductor package device with heat dissipation surface structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 2153US2010018761A1Embedded chip substrate and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 2252US9768103B2Fabrication method of embedded chip substrateADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 19, 2017·0 cites·8 claims
- 2352US2024030155A1Wafer level chip scale package unitPANJIT INT INC·Filed 2022·Application pending·0 cites
- 2451US2024387350A1Package with embedded tracesPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2549US2005040966A1[auto-control device and method of remotely controlling electronic appliances]PATENT WIRELESS TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 2649US2008012723A1Remote controllerPATEN WIRELESS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2747US2010006330A1Structure and process of embedded chip packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 2845US2005035946A1[optical mouse]PATENT WIRELESS TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 2945US2007220742A1Method for fabricating identification codeADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 3044US8528128B2Closure device for drain pipelineWANG YUNG-HUI·Filed 2010·Granted Sep 10, 2013·0 cites·5 claims
- 3144US2008180878A1Package structure with embedded capacitor, fabricating process thereof and applications of the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 3244US2004185719A1Signal adaptor for USB and PS/2 connectorFiled 2004·Application pending·0 cites
- 3344US2005057511A1[ball-actuated optical mouse]PATEN WIRELESS TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 3444US2008164562A1Substrate with embedded passive element and methods for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 3544US2005174976A1Auto-switching channel method of unidirectional wireless receiverFiled 2004·Application pending·0 cites
- 3643US2005251997A1Method for forming printed circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 3742US2006244726A1Wireless input devicePATEN WIRELESS TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3840US2006005384A1Manufacturing method of a multi-layer circuit board with an embedded passive componentADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 3936US2011036701A1Closed-air cushioned key switch structureWANG YUNG-HUI·Filed 2010·Application pending·0 cites
- 4034US2008212287A1Semiconductor package structure with buried electronic device and manufacturing method therofSHIH CHE-KUN·Filed 2008·Application pending·0 cites
- 4132US2018122749A1Semiconductor wafer, semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →