Inventor · disambiguated record
Yun Wei
Also filed as: WEI YUN · WEI YUN-HAN
6 granted patents·2 pending applications·6 citations·filing 2012–2024
70Inventor score
Top patents by PatentIndex Score
8 records- 0194US11342275B2Leadless power amplifier packages including topside terminations and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 24, 2022·4 cites·10 claims
- 0290US11984429B2Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereofNXP USA INC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0364US11621231B2Methods of fabricating leadless power amplifier packages including topside terminationsNXP USA INC·Filed 2022·Granted Apr 4, 2023·0 cites·19 claims
- 0458US2025391810A1Systems for optical oxide detection in semiconductor devices and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0546US11349438B2Power amplifier packages containing multi-path integrated passive devicesNXP USA INC·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 0635US10608588B2Amplifiers and related integrated circuitsNXP USA INC·Filed 2017·Granted Mar 31, 2020·0 cites·21 claims
- 0728US2013256756A1Integrated circuit having a staggered heterojunction bipolar transistor arrayWEI YUN·Filed 2012·Application pending·0 cites
- 0827US10389117B2Dynamic modeling and resilience for power distributionGEORGIA TECH RES INST·Filed 2015·Granted Aug 20, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →