Inventor · disambiguated record
Yun-Biao Xin
Also filed as: XIN YUN-BIAO
9 granted patents·264 citations·filing 1999–2008
90Inventor score
Top patents by PatentIndex Score
9 records- 0189US6454635B1Method and apparatus for a wafer carrier having an insertMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Sep 24, 2002·58 cites·16 claims
- 0287US6709981B2Method and apparatus for processing a semiconductor wafer using novel final polishing methodMEMC ELECTRONIC MATERIALS·Filed 2001·Granted Mar 23, 2004·52 cites·48 claims
- 0375US6479386B1Process for reducing surface variations for polished waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Nov 12, 2002·22 cites·37 claims
- 0467US6613591B1Method of estimating post-polishing waviness characteristics of a semiconductor waferMEMC ELECTRONIC MATERIALS·Filed 2002·Granted Sep 2, 2003·12 cites·14 claims
- 0567US6200908B1Process for reducing waviness in semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Mar 13, 2001·38 cites·22 claims
- 0665US7649624B1Systems and methods for detecting scratches on non-semiconductor wafer surfacesCRYSTAL TECH INC·Filed 2008·Granted Jan 19, 2010·3 cites·29 claims
- 0760US6114245AMethod of processing semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Sep 5, 2000·28 cites·17 claims
- 0859US6227944B1Method for processing a semiconductor waferMEMC ELECTRONICS MATERIALS INC·Filed 1999·Granted May 8, 2001·27 cites·14 claims
- 0958US6214704B1Method of processing semiconductor wafers to build in back surface damageMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Apr 10, 2001·24 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →