Inventor · disambiguated record
Yuntao Xu
Also filed as: XU YUNTAO
5 granted patents·7 pending applications·3 citations·filing 2019–2024
66Inventor score
Top patents by PatentIndex Score
12 records- 0190US11831232B2Power converter having a gate drive circuit and method of operatingGEN ELECTRIC·Filed 2021·Granted Nov 28, 2023·2 cites·19 claims
- 0289US12132391B2Power converter having a gate drive circuit and method of operatingGEN ELECTRIC·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 0380US2025055366A1Power converter apparatus and methodGEN ELECTRIC·Filed 2024·Application pending·0 cites
- 0458US12016715B2Chest X-ray system and methodKONINKLIJKE PHILIPS NV·Filed 2022·Granted Jun 25, 2024·0 cites·14 claims
- 0558US2025308971A1Semiconductor die singulation using die attach film and plasma dicingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0658US2025273541A1Interdigitated cantilever lead frame in chip-on-lead package designTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0756US11437808B2System for controlling phase shifting of superconducting electric machinesGEN ELECTRIC·Filed 2019·Granted Sep 6, 2022·0 cites·18 claims
- 0852US2025210470A1Polymeric die pad for die isolation in chip on lead packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0946US2024258120A1Laser-cut lead frame for integrated circuit (ic) packagesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1045US11128231B2System and method for exciting low-impedance machines using a current source converterGEN ELECTRIC·Filed 2019·Granted Sep 21, 2021·0 cites·17 claims
- 1143US2023170282A1Non-coplanar or bumped lead frame for electronic isolation deviceTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 1242US2023064066A1Wafer-level backside layer for semiconductor apparatusTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →