Inventor · disambiguated record
Yugo Yamamoto
Also filed as: YAMAMOTO YUGO
9 granted patents·10 pending applications·23 citations·filing 2002–2024
81Inventor score
Top patents by PatentIndex Score
19 records- 0183US8466238B2Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displaysTAMATANI HIROAKI·Filed 2008·Granted Jun 18, 2013·12 cites·8 claims
- 0275US7914641B2Sealing material for flat panel displayMITSUI CHEMICALS INC·Filed 2006·Granted Mar 29, 2011·4 cites·9 claims
- 0363US10050224B2Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing methodMITSUI CHEMICALS INC·Filed 2017·Granted Aug 14, 2018·0 cites·5 claims
- 0462US7495035B2Photo-curable resin composition and sealing agent for flat panel display using the sameMITSUI CHEMICALS INC·Filed 2004·Granted Feb 24, 2009·4 cites·9 claims
- 0558US2025115055A1Ink jet recording methodCANON KK·Filed 2024·Application pending·0 cites
- 0658US2025115046A1Liquid ejection apparatusCANON KK·Filed 2024·Application pending·0 cites
- 0756US8216684B2Method for bonding members, composite film and use thereofITO YUICHI·Filed 2006·Granted Jul 10, 2012·3 cites·16 claims
- 0852US2015034928A1Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing methodMITSUI CHEMICALS INC·Filed 2013·Application pending·0 cites
- 0950US11264589B2Image display device sealing material and image display device sealing sheetMITSUI CHEMICALS INC·Filed 2018·Granted Mar 1, 2022·0 cites·8 claims
- 1047US2022389268A1Ink-jet application type composition for wiring-line protection, method for producing semiconductor device using same, and semiconductor deviceMITSUI CHEMICALS INC·Filed 2020·Application pending·0 cites
- 1146US2008161471A1Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent DisplayMITSUI CHEMICALS INC·Filed 2006·Application pending·0 cites
- 1245US2022186066A1Protection member for semiconductor, protection composition for inkjet coating-type semiconductor, and method for producing semiconductor apparatus using same, and semiconductor apparatusMITSUI CHEMICALS INC·Filed 2020·Application pending·0 cites
- 1344US2014367670A1Surface sealing agent for organic el element, organic el device using same, and manufacturing method for sameMITSUI CHEMICALS INC·Filed 2013·Application pending·0 cites
- 1443US7211636B2Ionic compound, resin composition containing the same and use thereofMITSUI CHEMICALS INC·Filed 2005·Granted May 1, 2007·0 cites·6 claims
- 1541US8889803B2Polymerizable epoxy composition, and sealing material composition comprising the sameTAKAMATSU YASUSHI·Filed 2009·Granted Nov 18, 2014·0 cites·11 claims
- 1639US2017324040A1Surface sealing material for organic el elements and cured product of sameMITSUI CHEMICALS INC·Filed 2015·Application pending·0 cites
- 1735US9013049B2Surface sealant for optical semiconductor, method for manufacturing organic EL device, organic EL device and organic EL display panel using the sameYAMAMOTO YUGO·Filed 2012·Granted Apr 21, 2015·0 cites·24 claims
- 1832US2003062125A1Photocationic-curable resin composition and uses thereofFiled 2002·Application pending·0 cites
- 1931US2014131691A1Polymerizable epoxy composition and organic el deviceYAMAMOTO YUGO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →