Inventor · disambiguated record
Yuichi Yanaka
Also filed as: YANAKA YUICHI
2 granted patents·0 citations·filing 2018–2018
23Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0144US11890681B2Method for producing bonded object and semiconductor device and copper bonding pasteSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Feb 6, 2024·0 cites·9 claims
- 0242US11483936B2Method for producing joined body, and joining materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →