Inventor · disambiguated record
Yuchi Yang
Also filed as: YANG YUCHI
1 granted patent·1 pending application·0 citations·filing 2021–2021
10Inventor score
Technology areasH10W
Files withUNIV BEIJING2
Top patents by PatentIndex Score
2 records- 0146US12489033B2Silicon-based fan out package structure and preparation method thereforUNIV BEIJING·Filed 2021·Granted Dec 2, 2025·0 cites·12 claims
- 0237US2024266254A1Lead bonding structure comprising embedded manifold type micro-channel and preparation method for lead bonding structureUNIV BEIJING·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →