Inventor · disambiguated record
Yusin Yang
Also filed as: YANG YUSIN
17 granted patents·10 pending applications·14 citations·filing 2013–2025
87Inventor score
Top patents by PatentIndex Score
27 records- 0184US9466537B2Method of inspecting semiconductor device and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 11, 2016·5 cites·20 claims
- 0275US2024385220A1Test apparatus and test method thereofRYU SUNGYOON·Filed 2024·Application pending·0 cites
- 0375US2025341540A1Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0471US12474260B2Terahertz signal measuring apparatus and measuring methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0570US9583402B2Method of manufacturing a semiconductor device using semiconductor measurement systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 28, 2017·2 cites·19 claims
- 0670US9267903B2Methods and apparatuses for inspecting semiconductor devices using electron beamsPARK MIRA·Filed 2013·Granted Feb 23, 2016·4 cites·24 claims
- 0769US12385946B2Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·8 claims
- 0869US10393672B2System and method of inspecting substrate and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 27, 2019·2 cites·20 claims
- 0968US12092656B2Test apparatus and test method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 1068US11004712B2Method of inspecting semiconductor wafer, inspection system for performing the same, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 1161US2025003734A1Material measurement system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1251US11486834B2Substrate inspection method and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 1351US2025231121A1Wafer inspection methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1449US2018096903A1Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1548US10845232B2Mass flow controller, apparatus for manufacturing semiconductor device, and method for maintenance thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 1648US9892980B2Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 13, 2018·0 cites·16 claims
- 1746US2021140899A1Substrate inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1845US2020182783A1Measuring apparatus and substrate analysis method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1943US10460436B2Inspection method, inspection system, and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 2041US10482593B2Inspection method, inspection system, and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·0 cites·20 claims
- 2141US2020194294A1Spectroscopic system, optical inspection method, and semiconductor device fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2240US10269111B2Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·19 claims
- 2338US10720365B2Method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 21, 2020·0 cites·20 claims
- 2438US9455121B2Semiconductor inspection system and methods of inspecting a semiconductor device using the sameKIM HYUNWOO·Filed 2015·Granted Sep 27, 2016·0 cites·18 claims
- 2536US10088297B2Apparatus and method for measuring thicknessSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 2634US2017200658A1Methods of inspecting substrates and semiconductor fabrication methods incorporating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2726US2017083587A1Data collecting/processing system and product manufacturing/analyzing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →