Inventor · disambiguated record
Yusuke Yasuda
Also filed as: YASUDA YUSUKE
11 granted patents·13 pending applications·39 citations·filing 2007–2022
87Inventor score
Top patents by PatentIndex Score
24 records- 0188US7955411B2Low temperature bonding material comprising metal particles and bonding methodHITACHI LTD·Filed 2007·Granted Jun 7, 2011·13 cites·22 claims
- 0283US8400777B2Electronic member, electronic part and manufacturing method thereforIDE EIICHI·Filed 2010·Granted Mar 19, 2013·6 cites·6 claims
- 0373US8821676B2Low temperature bonding material comprising coated metal nanoparticles, and bonding methodYASUDA YUSUKE·Filed 2011·Granted Sep 2, 2014·3 cites·7 claims
- 0471US10075123B2Semiconductor device, motor control system, and control method for semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Sep 11, 2018·1 cites·15 claims
- 0571US8513534B2Semiconductor device and bonding materialMORITA TOSHIAKI·Filed 2009·Granted Aug 20, 2013·6 cites·15 claims
- 0670US11159073B2Motor including sealing structureNIDEC CORP·Filed 2018·Granted Oct 26, 2021·1 cites·9 claims
- 0770US8821768B2Bonding method and bonding material using metal particleYASUDA YUSUKE·Filed 2007·Granted Sep 2, 2014·5 cites·14 claims
- 0868US8592996B2Semiconductor device and method of manufacturing the sameMORITA TOSHIAKI·Filed 2010·Granted Nov 26, 2013·3 cites·19 claims
- 0961US2024335879A1Method for measuring deformation amount of deformation part of additively manufactured test object and method for determining optimum condition for additive manufacturingPROTERIAL LTD·Filed 2022·Application pending·0 cites
- 1058US8008772B2Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereofHITACHI LTD·Filed 2008·Granted Aug 30, 2011·1 cites·17 claims
- 1150US2025050586A1Additive manufacturing condition search device and additive manufacturing condition search methodHITACHI LTD·Filed 2022·Application pending·0 cites
- 1249US2008160183A1Conductive sintered layer forming composition and conductive coating film forming method and bonding method using the sameIDE EIICHI·Filed 2007·Application pending·0 cites
- 1348US2013119322A1Conductive sintered layer forming compositionIDE EIICHI·Filed 2013·Application pending·0 cites
- 1447US2012104618A1Low temperature bonding material and bonding methodYASUDA YUSUKE·Filed 2012·Application pending·0 cites
- 1547US2011156225A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1647US2014147661A1Method for producing alumina-crystal-particle-dispersed alumina sol, alumina-crystal-particle-dispersed alumina sol obtained by the method, and aluminum coated member produced using the solHITACHI LTD·Filed 2013·Application pending·0 cites
- 1743US2009180914A1Interconnect material and interconnect formation methodHITACHI LTD·Filed 2008·Application pending·0 cites
- 1841US10819266B2Motor driving system and motor driving methodRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 1941US2007298244A1Bonding materials having particle with anisotropic shapeYASUDA YUSUKE·Filed 2007·Application pending·0 cites
- 2041US2013105980A1Sinterable bonding material using copper nanoparticles, process for producing same, and method of bonding electronic componentHITACHI LTD·Filed 2012·Application pending·0 cites
- 2135US10128721B2MotorNIDEC CORP·Filed 2015·Granted Nov 13, 2018·0 cites·9 claims
- 2234US2017278589A1Metal oxide particles for bonding, sintering binder including same, process for producing metal oxide particles for bonding, and method for bonding electronic componentsHITACHI LTD·Filed 2015·Application pending·0 cites
- 2334US2017288116A1Stress Relaxation Structure and Thermoelectric Conversion ModuleHITACHI METALS LTD·Filed 2017·Application pending·0 cites
- 2432US2015207445A1Semiconductor device and driving apparatusRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →